tag: MIPS

Power Panel: IP And Other Key Issues For Future Development
By Ed Sperling - 17 Mar, 2011 - Comments: 0

By Ed Sperling Low-Power Engineering chaired a DesignCon panel of low-power experts with Bhanu Kapoor, president of Mimasic; Kesava Talupuru, DV engineer at MIPS; Prapanna Tiwari, CAE manager at Synopsys, and Rob Aitken, an ARM Fellow. What follows are excerpts of their presentations and the panel discussion that followed. Prapanna Tiwari: UPF and CPF are text files that capture the power i... » read more

The True Test Of IP Reuse
By Ed Sperling - 17 Mar, 2011 - Comments: 0

By Ann Steffora Mutschler Fewer and fewer systems and semiconductor companies are designing brand new processors from scratch. Instead, they leverage as much IP as possible in their designs, investing selectivity in areas where they can add significant value. The challenges are varied from low-power issues to process technology migrations. Generally, IP consumers are doing two levels of IP-... » read more

Experts At The Table: Billion-Gate Design Challenges
By Ed Sperling - 17 Mar, 2011 - Comments: 0

By Ed Sperling Low-Power Engineering sat down to discuss billion-gate design challenges with Charles Janac, CEO of Arteris; Jack Browne, senior vice president of sales and marketing at Sonics; Kalar Rajendiran, senior director of marketing at eSilicon; Mark Throndson, director of product marketing at MIPS; and Mark Baker, senior director of business development at Magma. What follows are excer... » read more

Billion-Gate Chips
By Ed Sperling - 16 Mar, 2011 - Comments: 0

Low-Power Engineering examines hurdles ranging from power to cost in billion-gate IC designs with Arteris; Jack Browne, senior vice president of sales and marketing at Sonics; Kalar Rajendiran, senior director of marketing at eSilicon; Mark Throndson, director of product marketing at MIPS; and Mark Baker, senior director of business development at Magma. [youtube vid=0jum2ThIVzg] » read more

The Growing Importance Of Subsystems
By Ed Sperling - 24 Feb, 2011 - Comments: 0

By Ed Sperling A growing reliance on third-party IP is beginning to expand well beyond just IP blocks and into full subsystems, opening significant growth opportunities for companies competing in this market as well as enormous business and technical challenges. The IP market is ripe for this kind of convergence. Complexity at advanced process nodes coupled with time-to-market demands has e... » read more

Power Panel: IP And Other Key Issues For Future Development
By Ed Sperling - 10 Feb, 2011 - Comments: 0

Low-Power Engineering chaired a DesignCon panel of low-power experts with Bhanu Kapoor, president of Mimasic; Kesava Talupuru, DV engineer at MIPS; Prapanna Tiwari, CAE manager at Synopsys, and Rob Aitken, an ARM Fellow. What follows are excerpts of their presentations and the panel discussion that followed. Bhanu Kapoor: There are two components of power—dynamic and leakage. Dynamic is wh... » read more

What’s A Cell Phone?
By Ed Sperling - 27 Jan, 2011 - Comments: 0

By Ed Sperling Just because a smart phone is sold by Verizon or AT&T mobile no longer means that it will be used primarily as a phone. That distinction may sound trivial, but it has deep implications for the components that are used inside of these devices, how they’re used, and who wins the designs. Shifts such as this can also lead to broad changes in who buys the tools to develop t... » read more

Embedded Computing Down To Two Major Camps
By Ed Sperling - 27 Jan, 2011 - Comments: 0

By Pallab Chatterjee The 2011 CES show was highlighted by the large number of tablet computers and mobile devices that support Internet access. The form factor for these devices is based on use models, but the computing capabilities are based on the power and operational life between charges. The platforms are drawing diving lines between x86 cores vs ARM cores, and CPUs vs GPUs. While on t... » read more

Embedded Computing Down To Two Major Camps
By Ed Sperling - 27 Jan, 2011 - Comments: 0

By Pallab Chatterjee The 2011 CES show was highlighted by the large number of tablet computers and mobile devices that support Internet access. The form factor for these devices is based on use models, but the computing capabilities are based on the power and operational life between charges. The platforms are drawing diving lines between x86 cores vs ARM cores, and CPUs vs GPUs. While on t... » read more

Supply Chain Adjusts To Design At The System Level
By Ed Sperling - 16 Dec, 2010 - Comments: 0

By Ann Steffora Mutschler System-level design is impacting the supply chain at many levels. Software suppliers, IP providers, semiconductor companies, system integrators and OEMs are challenged to work ever more closely together and find a new balance of power for who controls what in the content of an SoC. “We see more and more the design chain driving how our tools work together,” Fra... » read more

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