Chip Industry Technical Paper Roundup: April 23


New technical papers recently added to Semiconductor Engineering’s library. [table id=216 /] Find last week’s technical paper additions here. » read more

Chip Industry Week In Review


SK hynix and TSMC plan to collaborate on HBM4 development and next-generation packaging technology, with plans to mass produce HBM4 chips in 2026. The agreement is an early indicator for just how competitive, and potentially lucrative, the HBM market is becoming. SK hynix said the collaboration will enable breakthroughs in memory performance with increased density of the memory controller at t... » read more

2D van der Waals Magnets Above Room Temperature (MIT)


A new technical paper titled "Field-free deterministic switching of all–van der Waals spin-orbit torque system above room temperature" was published by researchers at MIT, with funding by the NSF and U.S. Department of Energy. Abstract "Two-dimensional van der Waals (vdW) magnetic materials hold promise for the development of high-density, energy-efficient spintronic devices for memory an... » read more

AI Takes Aim At Chip Industry Workforce Training


When all the planned fabs become operational, the semiconductor industry is likely to face a worker shortage of 100,000 each in the U.S. and Europe, and more than 200,000 in Asia-Pacific, according to a McKinsey report. Since the dawn of technology, people have worried that robots, automation, and AI will steal their jobs, but these tools also can be put to use to help fill the chip industry ta... » read more

Chip Industry Week In Review


By Adam Kovac, Gregory Haley, and Liz Allan. The U.S. government released a 61-page report, titled "National Strategy on Microelectronics Research,” by the Subcommittee On Microelectronics Leadership. It provides a framework for government, industry, academia, and international allies to address four major goals. Synopsys  acquired Intrinsic ID, which develops physical unclonable func... » read more

Chip Industry Technical Paper Roundup: Mar. 11


New technical papers added to Semiconductor Engineering’s library this week. [table id=205 /] More ReadingTechnical Paper Library home » read more

Ultrathin vdW Ferromagnet at Room Temperature (MIT)


A technical paper titled “Current-induced switching of a van der Waals ferromagnet at room temperature” was published by researchers at Massachusetts Institute of Technology (MIT). Abstract: "Recent discovery of emergent magnetism in van der Waals magnetic materials (vdWMM) has broadened the material space for developing spintronic devices for energy-efficient computation. While there has... » read more

A Hypermultiplexed Integrated Tensor Optical Processor (USC, MIT et al.)


A technical paper titled “Hypermultiplexed Integrated Tensor Optical Processor” was published by researchers at the University of Southern California, Massachusetts Institute of Technology (MIT), City University of Hong Kong, and NTT Research. Abstract: "The escalating data volume and complexity resulting from the rapid expansion of artificial intelligence (AI), internet of things (IoT) a... » read more

Research Bits: Mar. 5


Anti-ambipolar transistor Materials scientists from the City University of Hong Kong propose using transistors made of mixed-dimensional nanowires and nanoflakes to create multivalued logic devices. By combining GaAsSb nanowires and MoS2 nanoflakes, the team created a hetero-transistor with anti-ambipolar transfer characteristics, in which positive (holes) and negative (electron) charge car... » read more

Efficient Streaming Language Models With Attention Sinks (MIT, Meta, CMU, NVIDIA)


A technical paper titled “Efficient Streaming Language Models with Attention Sinks” was published by researchers at Massachusetts Institute of Technology (MIT), Meta AI, Carnegie Mellon University (CMU), and NVIDIA. Abstract: "Deploying Large Language Models (LLMs) in streaming applications such as multi-round dialogue, where long interactions are expected, is urgently needed but poses tw... » read more

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