tag: MIT

Research Bits: Jan. 13
By Jesse Allen - 13 Jan, 2025 - Comments: 0

High-temp electrochemical memory Researchers from the University of Michigan and Sandia National Laboratory propose a nonvolatile electrochemical memory that can store and rewrite information at temperatures over 1100°F (600°C), enabling it to continue working in environments as extreme as the surface of Venus. Instead of transporting electrons, the memory moves oxygen ions between layere... » read more

Research Bits: Dec. 24
By Jesse Allen - 24 Dec, 2024 - Comments: 0

Growing multilayered chips Researchers from MIT, Samsung Advanced Institute of Technology, Sungkyunkwan University, and University of Texas at Dallas developed a method to fabricate a multilayered chip with alternating layers of semiconducting material grown directly on top of each other. The approach enables high-performance transistors and memory and logic elements on any random crystalline ... » read more

Chip Industry Technical Paper Roundup: Dec. 23
By Linda Christensen - 23 Dec, 2024 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=394 /] Find all technical papers here. » read more

Chip Industry Week In Review
By The SE Staff - 20 Dec, 2024 - Comments: 0

Updated for 12/20 government fundings and 12/23 for China trade investigation announcements. President Biden announced a trade investigation into "China's unfair trade practices in the semiconductor sector."  The announcement stated "PRC semiconductors often enter the U.S. market as a component of finished goods. This Section 301 investigation will examine a broad range of the PRC’s non-m... » read more

Research Bits: Dec. 11
By Jesse Allen - 11 Dec, 2024 - Comments: 0

Photonic AI processor Researchers from Massachusetts Institute of Technology (MIT), Enosemi, and Periplous developed a fully integrated photonic processor that can perform all the key computations of a deep neural network optically on the chip. The chip is fabricated using commercial foundry processes and uses three layers of devices that perform linear and nonlinear operations. A particula... » read more

Chip Industry Week In Review
By The SE Staff - 06 Dec, 2024 - Comments: 0

Global chips sales hit a record $56.9 billion in October, a 22% increase versus October 2023, according to the Semiconductor Industry Association. Also, global semiconductor equipment billings reached $30.38 billion in Q3 2024, a 19% YoY increase and 13% growth QoQ, SEMI reported. TSMC commenced equipment installation for its 2nm fab in Kaohsiung, Taiwan, six months ahead of schedule. The 2n... » read more

Manipulating Diamond Surface Chemistry By UV Laser Etching (Macquarie Univ., MIT)
By Technical Paper Link - 03 Dec, 2024 - Comments: 0

A new technical titled "The effects of sub-monolayer laser etching on the chemical and electrical properties of the (100) diamond surface" was published by researchers at Macquarie University and MIT. Abstract "Tailoring the surface chemistry of diamond is critical to a range of applications from quantum science to electronics. It has been recently shown that dosing the diamond surface with... » read more

Research Bits: Dec. 3
By Jesse Allen - 03 Dec, 2024 - Comments: 0

Self-assembly of mixed-metal oxide arrays Researchers from North Carolina State University and Iowa State University demonstrated a technique for self-assembling electronic devices. The proof-of-concept work was used to create diodes and transistors with high yield and could be used for more complex electronic devices. “Our self-assembling approach is significantly faster and less expensi... » read more

Research Bits: Nov. 25
By Jesse Allen - 25 Nov, 2024 - Comments: 0

3D-printed ESD protection Researchers from Lawrence Livermore National Laboratory developed a printable elastomeric silicone foam for electronics packaging that provides both mechanical and electrostatic discharge (ESD) protection. The team used a 3D printing technique called direct ink writing (DIW), an extrusion process in which a paste with controlled rheological properties such as elast... » read more

Chip Industry Week In Review
By The SE Staff - 22 Nov, 2024 - Comments: 0

SK hynix started mass production of 1-terabit  321-high NAND, with availability scheduled for the first half of next year. Rapidus will receive an additional ¥200 billion yen ($1.28B) from the Japanese government beginning in fiscal year 2025, reports Nikkei. This is on top of ¥920 billion yen ($5.98B) Rapidus has already received from the government in support of its goal to reach commer... » read more

← Older posts

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2025 SMG   |  Terms of Service  |  Privacy Policy