tag: MIT

Week In Review: Auto, Security, Pervasive Computing
By Liz Allan - 07 Jul, 2023 - Comments: 0

Joby Aviation and Alef Automotive each received a Special Airworthiness Certificate from the U.S. Federal Aviation Administration (FAA) for an electric vertical take-off and landing (eVTOL) aircraft. Joby will now begin flight testing the prototype, and the aircraft will move to Edwards Air Force Base in 2024 as part of a contract with the U.S. Air Force. Alef’s model is the first U.S. govern... » read more

A Design Architecture For Optically Broadband Programmable PICs Utilizing Micromechanical Resonances 
By Technical Paper Link - 06 Jul, 2023 - Comments: 0

A technical paper titled “Synchronous micromechanically resonant programmable photonic circuits” was published by researchers at The MITRE Corporation, Massachusetts Institute of Technology, Sandia National Laboratories, University of Arizona, and Brookhaven National Laboratory. Abstract: "Programmable photonic integrated circuits (PICs) are emerging as powerful tools for the precise ... » read more

Week In Review: Auto, Security, Pervasive Computing
By Liz Allan - 30 Jun, 2023 - Comments: 0

Inflection AI raised $1.3 billion in a new funding round led by Microsoft, Reid Hoffman, Bill Gates, Eric Schmidt, and NVIDIA after raising $225 million in the first round to support the ongoing development of Pi, a “useful, friendly, and fun” AI. In partnership with CoreWeave and NVIDIA, Inflection aims to build the world’s largest AI cluster, comprised of 22,000 NVIDIA H100 Tensor Core ... » read more

Week In Review: Semiconductor Manufacturing, Test
By Gregory Haley - 16 Jun, 2023 - Comments: 0

Applied Materials sued its Chinese-owned rival, Mattson, over an alleged 14-month effort to steal valuable trade secrets, reports Bloomberg. In court filing, Applied Materials claimed that Mattson engaged in a spree of employee-poaching and covertly transferring semiconductor equipment designs. Global semiconductor materials revenue grew 8.9% to $72.7 billion in 2022, surpassing the previous... » read more

Security Becomes Much Bigger Issue For AI/ML Chips, Tools
By Lou Covey - 01 Jun, 2023 - Comments: 0

Security is becoming a bigger issue in AI and machine learning chips, in part because the chip industry is racing just to get new devices working, and in part because it's difficult to secure a new technology that is expected to adapt over time. And unlike in the past, when tools and methodologies were relatively fixed, nearly everything is in motion. Algorithms are being changed, EDA tools ... » read more

Chip Industry’s Technical Paper Roundup: May 16
By Linda Christensen - 16 May, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=103 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us... » read more

Rethinking Engineering Education In The U.S.
By Karen Heyman - 11 May, 2023 - Comments: 7

The CHIPS Act, as well as the ongoing need for talent, is causing both industry and academia in America to rethink engineering education, resulting in new approaches and stronger partnerships. As an example, Arizona State University (ASU) now has a Secure, Trusted, and Assured Microelectronics Center (STAM). The center offers an interdisciplinary approach to learning secure and trusted semic... » read more

Research Bits: May 10
By Jesse Allen - 10 May, 2023 - Comments: 0

Growing 2D TMDs on chips Researchers from Massachusetts Institute of Technology (MIT), Oak Ridge National Laboratory, and Ericsson Research found a way to “grow” layers of 2D transition metal dichalcogenide (TMD) materials directly on top of a fully fabricated silicon chip, a technique they say could enable denser integrations. The researchers focused on molybdenum disulfide, which is f... » read more

Toolbox For Designing Heterogeneous Quantum Systems
By Technical Paper Link - 08 May, 2023 - Comments: 0

A new technical paper titled "Microarchitectures for Heterogeneous Superconducting Quantum Computers" was published by researcher at: Pacific Northwest National Laboratory, Princeton University, University of Chicago, Rutgers University, MIT, Brookhaven National Laboratory, and Infleqtion. Abstract: "Noisy Intermediate-Scale Quantum Computing (NISQ) has dominated headlines in recent years, ... » read more

Chip Industry’s Technical Paper Roundup: May 8
By Linda Christensen - 08 May, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=102 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy