Security Research: Technical Paper Round-up


A number of hardware security-related technical papers were presented at the August 2023 USENIX Security Symposium. Here are some highlights with associated links. [table id=130 /] A complete listing of all papers presented at this summer's USENIX conference can be found here and here. The organization provides open access research, and the presentation slides and papers are free to the p... » read more

Week In Review: Design, Low Power


Arm filed its registration statement for a highly anticipated IPO. Chip industry heavyweights Apple, Samsung, NVIDIA, and Intel are all expected to invest. Find the SEC filing here. Taiwan’s National Science and Technology Council (NSTC) laid out a 10-year initiative to bolster its IC design market share to 40% worldwide by 2033, with the first year’s budget of US $376 million. The sh... » read more

Week In Review: Auto, Security, Pervasive Computing


The AI chip market is booming. Gartner expects revenue for the year will hit $53.4 billion, up 20.9% from 2022. The firm predicts that number will grow to $119 billion by 2027.  In the consumer electronics market, the value of AI-enabled application processors will amount to $1.2 billion in 2023, up from $558 million in 2022. Germany will spend nearly €1 billion (~US$1.7B) over the next t... » read more

Remote Direct Memory Introspection (Rice, Duke, MIT)


A technical paper titled "Remote Direct Memory Introspection" was published by researchers at Rice University, Duke University, and MIT. This paper won a distinguished paper award at the recent 32nd USENIX Security Symposium. Abstract: "Hypervisors have played a critical role in cloud security, but they introduce a large trusted computing base (TCB) and incur a heavy performance tax. As of... » read more

Week In Review: Automotive, Security and Pervasive Computing


The AAA Foundation for Traffic Safety estimates that between 2021 and 2050, ADAS technologies currently available to U.S. will prevent "approximately 37 million crashes, 14 million injuries, and nearly 250,000 deaths, which would represent 16% of crashes and injuries, and 22% of deaths that would otherwise occur on U.S. roads without these technologies," according to a new report. Governmen... » read more

Week In Review: Auto, Security, Pervasive Computing


Intel issued an advisory of a potential security vulnerability in some of its processors. The company recommends updating to the latest firmware version. NVIDIA unveiled its GH200 Grace Hopper platform, based on 144 Arm Neoverse cores and 282GB of HBM3e memory. Meanwhile, Chinese internet companies including Baidu, ByteDance, Tencent, and Alibaba ordered about $5 billion worth of A800 proces... » read more

Chip Industry’s Technical Paper Roundup: August 9


New technical papers recently added to Semiconductor Engineering’s library: [table id=124 /] More Reading Technical Paper Library home » read more

Week In Review: Auto, Security, Pervasive Computing


Hyundai, Samsung Catalyst Fund, and others invested a combined $100 million in Canada-based Tenstorrent to accelerate the design and development of AI chiplets and machine-learning software and allow the integration of AI into future Hyundai, Kia, and Genesis vehicles, plus other future mobilities such as robotics and advanced air mobility (AAM). The National Highway Traffic Safety Administr... » read more

Week In Review: Design, Low Power


Qualcomm, NXP, Infineon, Nordic, and Bosch are jointly investing in a new RISC-V company, to be formed in Germany, that will speed up RISC-V’s adoption in commercial products. The company will be “a single source to enable compatible RISC-V based products, provide reference architectures, and help establish solutions widely used in the industry,” according to a press release. The co... » read more

Demonstrating The Strong Superconducting Diode Effect In Conventional SC Thin films


A technical paper titled “Ubiquitous Superconducting Diode Effect in Superconductor Thin Films” was published by researchers at Massachusetts Institute of Technology (MIT), IBM Research Europe, U.S. Army DEVCOM Army Research Laboratory, Centro de Física de Materiales (CFM-MPC), Hanford High School, Vestavia Hills High School, Donostia International Physics Center (DIPC), Condensed Matter ... » read more

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