tag: MITRE

Week In Review: Manufacturing, Test
By Karen Heyman - 11 Aug, 2023 - Comments: 0

TSMC, Bosch, Infineon, and NXP will jointly invest in the European Semiconductor Manufacturing Co. (ESMC), in Dresden, Germany, to provide advanced semiconductor manufacturing services. ESMC marks a significant step toward construction of a 300mm fab, which is expected to have a monthly production capacity of 40,000 300mm (12-inch) wafers on TSMC’s 28/22nm planar CMOS and 16/12nm finFET proce... » read more

Week In Review: Auto, Security, Pervasive Computing
By Liz Allan - 28 Jul, 2023 - Comments: 0

BMW, General Motors, Honda, Hyundai, Kia, Mercedes-Benz, and Stellantis will create an electric vehicle charging network, installing more than 30,000 high-powered DC charge points accessible to any cars that use Combined Charging System (CCS) or North American Charging Standard (NACS) connectors. Opening summer 2024, the network will leverage Plug & Charge technology and allow easy digital ... » read more

Week In Review: Auto, Security, Pervasive Computing
By Liz Allan - 21 Jul, 2023 - Comments: 0

The Biden-Harris Administration announced the U.S. Cyber Trust Mark, a cybersecurity certification and labeling program to help consumers choose smart devices less vulnerable to cyberattacks. The Federal Communications Commission (FCC) is applying to register the Cyber Trust Mark with the U.S. Patent and Trademark Office and it would appear on qualifying smart products, including refrigerators,... » read more

Week In Review: Auto, Security, Pervasive Computing
By Marie C. Baca - 14 Oct, 2022 - Comments: 0

Automotive, Mobility Hyundai announced all of its vehicles will be software-defined vehicles (SDVs) by 2025. The company said all newly launched Hyundai vehicles will be able to receive over-the-air software updates next year, and that it expects to register 20 million vehicles to its Connected Car Services system by 2025. Hyundai also said it will invest the equivalent of more than $12 billio... » read more

Automating The Detection of Hardware Common Weakness Enumerations In Early Design
By Technical Paper Link - 12 Oct, 2022 - Comments: 0

A new technical paper titled "Don't CWEAT It: Toward CWE Analysis Techniques in Early Stages of Hardware Design" was published by researchers at NYU, Intel, Duke and University of Calgary. "To help prevent hardware security vulnerabilities from propagating to later design stages where fixes are costly, it is crucial to identify security concerns as early as possible, such as in RTL designs. ... » read more

Is Standardization Required For Security?
By Ann Mutschler - 04 Aug, 2022 - Comments: 1

Semiconductor Engineering sat down to discuss chip and system security with Mike Borza, fellow and scientist on the security IP team at Synopsys; Lee Harrison, automotive IC test solutions manager at Siemens Digital Industries Software; Jason Oberg, founder and CTO of Cycuity (formerly Tortuga Logic); Nicole Fern, senior security analyst at Riscure; Norman Chang, fellow and CTO of the electroni... » read more

Week In Review: Manufacturing, Test
By Ed Sperling - 08 Apr, 2022 - Comments: 0

Deals AMD plans to purchase cloud startup Pensando for about US $1.9 billion. In a presentation at the SEMI ISS conference this week, AMD CTO Mark Papermaster described Pensando's technology as a "highly programmable packet-processing engine that allows you to speed up systems designed for the data center." Intel, Micron, Analog Devices and MITRE Engenuity formed an alliance to accelerate c... » read more

Hardware Security Optimization With MITRE CWE
By Anders Nordstrom - 03 Mar, 2022 - Comments: 0

Whether you’re just starting to build out a hardware security program at your organization, or you’re looking to optimize existing hardware security processes, the MITRE Common Weakness Enumeration (CWE) database is an excellent resource to keep in your toolbox. What is CWE? A CWE is a type of vulnerability, or flaw, in the design of either hardware or software in embedded systems. Indi... » read more

Why It’s So Difficult — And Costly — To Secure Chips
By Ed Sperling - 02 Dec, 2021 - Comments: 0

Rising concerns about the security of chips used in everything from cars to data centers are driving up the cost and complexity of electronic systems in a variety of ways, some obvious and others less so. Until very recently, semiconductor security was viewed more as a theoretical threat than a real one. Governments certainly worried about adversaries taking control of secure systems through... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 12 Nov, 2021 - Comments: 0

Chipmakers AMD has rolled out its new MI200 series products, the first exascale-class GPU accelerators. Using a fan-out bridge packaging technology, the MI200 series are designed for high-performance computing (HPC) and artificial intelligence (AI) applications. The MI200 series accelerators feature a multi-die GPU architecture with 128GB of HBM2e memory. Typically, the HBM2e memory stack a... » read more

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