Chipmakers Model AI For Radio Access Networks

By Martha DeGrasse - 22 Aug, 2022 - Comments: 0

The chips that power and connect smartphones are now foundational to a disparate portfolio of daily tasks we take for granted, from accessing the internet to snapping a photo or asking Siri or Google if rain is in the forecast. Most people don’t think twice about the conflicting demands these tasks can place on semiconductors, but for engineers at leading chip manufacturers, this balancing ac... » read more

AI Power Consumption Exploding

By Brian Bailey - 15 Aug, 2022 - Comments: 2

Machine learning is on track to consume all the energy being supplied, a model that is costly, inefficient, and unsustainable. To a large extent, this is because the field is new, exciting, and rapidly growing. It is being designed to break new ground in terms of accuracy or capability. Today, that means bigger models and larger training sets, which require exponential increases in processin... » read more

ML And UVM Share Same Flaws

By Brian Bailey - 28 Jul, 2022 - Comments: 1

A number of people must be scratching their heads over what UVM and machine learning (ML) have in common, such that they can be described as having the same flaws. In both cases, it is a flaw of omission in some sense. Let's start with ML, and in particular, object recognition. A decade ago, Alexnet, coupled with GPUs, managed to beat all of the object detection systems that relied on tradit... » read more

Bespoke Silicon Redefines Custom ASICs

By Ann Mutschler - 28 Jul, 2022 - Comments: 0

Semiconductor Engineering sat down to discuss bespoke silicon and what's driving that customization with Kam Kittrell, vice president of product management in the Digital & Signoff group at Cadence; Rupert Baines, chief marketing officer at Codasip; Kevin McDermott, vice president of marketing at Imperas; Mo Faisal, CEO of Movellus; Ankur Gupta, vice president and general manager of Siemens... » read more

Customization, Heterogenous Integration, And Brute Force Verification

By Ed Sperling - 14 Jul, 2022 - Comments: 0

Semiconductor Engineering sat down to discuss why new approaches are required for heterogeneous designs, with Bari Biswas, senior vice president for the Silicon Realization Group at Synopsys; John Lee, general manager and vice president of the Ansys Semiconductor business unit; Michael Jackson, corporate vice president for R&D at Cadence; Prashant Varshney, head of product for Microsoft Azu... » read more

Improving Yield With Machine Learning

By Laura Peters - 12 Jul, 2022 - Comments: 0

Machine learning is becoming increasingly valuable in semiconductor manufacturing, where it is being used to improve yield and throughput. This is especially important in process control, where data sets are noisy. Neural networks can identify patterns that exceed human capability, or perform classification faster. Consequently, they are being deployed across a variety of manufacturing proce... » read more

Who Does Processor Validation?

By Brian Bailey - 27 Jun, 2022 - Comments: 1

Defining what a processor is, and what it is supposed to do, is not always as easy as it sounds. In fact, companies are struggling with the implications of hundreds of heterogenous processing elements crammed into a single chip or package. Companies have extensive verification methodologies, but not for validation. Verification is a process of ensuring that an implementation matches a specif... » read more

Active Learning: Integrating Natural Intelligence Into Artificial Intelligence

By Oliver Gnepper - 09 Jun, 2022 - Comments: 0

Today, very few people would likely deny the fact that data can present major added value for companies. But analyzing data from production processes reveals the incompleteness of data collection and the associated reduced potential of the data that can be leveraged. Typical shortcomings include: Incomplete representation of processes in the dataspace, Inadequate connection of processes... » read more

DRAM Thermal Issues Reach Crisis Point

By Karen Heyman - 09 Jun, 2022 - Comments: 5

Within the DRAM world, thermal issues are at a crisis point. At 14nm and below, and in the most advanced packaging schemes, an entirely new metric may be needed to address the multiplier effect of how thermal density increasingly turns minor issues into major problems. A few overheated transistors may not greatly affect reliability, but the heat generated from a few billion transistors does.... » read more

AI-Powered Verification

By Brian Bailey - 01 Jun, 2022 - Comments: 1

With functional verification consuming more time and effort than design, the chip industry is looking at every possible way to make the verification process more effective and more efficient. Artificial intelligence (AI) and machine learning (ML) are being tested to see how big an impact they can have. While there is progress, it still appears to be just touching the periphery of the problem... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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