So Many Waivers Hiding Issues

By Brian Bailey - 05 Oct, 2018 - Comments: 0

Semiconductor Engineering sat down to discuss problems associated with domain crossings with Alex Gnusin, design verification technologist for Aldec; Pete Hardee, director, product management for Cadence; Joe Hupcey, product manager and verification product technologist for Mentor, a Siemens Business; Sven Beyer, product manager design verification for OneSpin; and Godwin Maben, applications en... » read more

Autonomy, Electrification And The Rise Of Model-Based EE Design

By Mentor, a Siemens Business - 09 Jul, 2018 - Comments: 0

Powerful software that automatically transforms input models into deterministic outputs is transforming automotive electrical and electronics (EE) design. Martin O'Brien and Dan Scott set the stage for Mentor's advanced generative engineering approach. To read more, click here. » read more

Comprehensive CDC Verification Using Advanced Hierarchical Data Models

By Mentor, a Siemens Business - 27 Jun, 2018 - Comments: 0

In this paper, we describe the hierarchical data model (HDM), which is a performance efficient alternative to the traditional flat CDC verification flow. The HDM is equivalent to an abstract CDC model of the IP that captures the CDC intent of the block along with its integration rules. It is a generic data model that can be seamlessly re-used across releases and across designs wherever the IP i... » read more

The Veloce Strato Platform: Unique Core Components Create High-Value Advantages

By Mentor, a Siemens Business - 13 Jun, 2018 - Comments: 0

The Veloce Strato Emulation platform has sufficient execution speed, full visibility capabilities and ease-of-use in model creation and model updates to span the entire range of needs throughout the life of the design development process. To read more, click here. » read more

The Trouble With Models

By Ed Sperling - 20 Dec, 2017 - Comments: 0

Models are becoming more difficult to develop, integrate and utilize effectively at 10/7nm and beyond as design complexity, process variation and physical effects add to the number of variables that need to be taken into account. Modeling is a way of abstracting the complexity in various parts of the semiconductor design, and there can be dozens of models required for complex SoCs. Some are ... » read more

Making Software Development Equivalent For Models And Boards

By Jason Andrews - 28 Sep, 2017 - Comments: 0

Selected Cortex-M processors include the instruction trace microcell (ITM) to help understand system behavior. Although it can provide other types of trace, the ITM is commonly associated with printf() output and event tracing from applications and operating systems. Historically, Fast Model systems have used semihosting or UART models to provide character and file I/O when running software on ... » read more

Fast Models, Cycle Models

By Jason Andrews - 27 Jul, 2017 - Comments: 0

There has been a lot of coverage since the launch of new CPU and graphics cores at Computex 2017, including some information about early software development. The public announcement of new ARM IP is a milestone for ARM Models because it means we can now talk about available models and share additional information about the new IP. ARM Fast Models and Cycle Models enable virtual prototyping ... » read more

Verification Unification

By Brian Bailey - 22 Jun, 2017 - Comments: 0

Semiconductor Engineering brought together industry luminaries to initiate the discussion about the role that formal technologies will play with Portable Stimulus and how it may help to bring the two execution technologies closer together. Participating in this roundtable are Joe Hupcey, verification product technologist for [getentity id="22017" e_name="Mentor, a Siemens Business"]; Tom Fitzpa... » read more

Power/Performance Bits: June 13

By Jesse Allen - 13 Jun, 2017 - Comments: 0

Theoretical all-carbon circuits Engineers at the University of Texas at Dallas, the University of Illinois at Urbana-Champaign, the University of Central Florida, and Northwestern University designed a novel computing system made solely from carbon. "The concept brings together an assortment of existing nanoscale technologies and combines them in a new way," said Dr. Joseph S. Friedman, ass... » read more

Huawei Delivers Outstandingly Accurate Models

By John Parry - 25 May, 2017 - Comments: 0

By John Parry, Mentor, a Siemens Business, and Yake Fang, Huawei Technologies Co., Ltd. Packaging high-performance multi-core IC devices used in communication applications is a key challenge for both manufacturers and system integrators. Traditionally a System-in-Package (SiP) has been taken, with chips mounted side-by-side, allowing differing semiconductor technologies to be mixed. More r... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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