tag: Moortec

Monitoring For In-Die Process Speed Detection
By Richard McPartland - 14 May, 2020 - Comments: 0

Chip designers working on advanced nodes typically include a fabric of sensors spread across the die for a number of very specific reasons. In this, the second of a three-part blog series, we explore some of the key applications and benefits of these types of sensing solutions. In this installment, the focus is In-Die Process Speed Detection and why understanding in-chip process speed detecti... » read more

Low-Power Analog
By Brian Bailey - 14 May, 2020 - Comments: 3

Analog circuitry is usually a small part of a large SoC, but it does not scale in the same way as digital circuitry under Moore's Law. The power consumed by analog is becoming an increasing concern, especially for battery-operated devices. At the same time, little automation is available to help analog designers reduce consumption. "Newer consumer devices, like smartphones and wearables, alo... » read more

‘More Than Moore’ Reality Check
By Ann Mutschler - 14 May, 2020 - Comments: 1

The semiconductor industry is embracing multi-die packages as feature scaling hits the limits of physics, but how to get there with the least amount of pain and at the lowest cost is a work in progress. Gaps remain in tooling and methodologies, interconnect standards are still being developed, and there are so many implementations of packaging that the number of choices is often overwhelming. ... » read more

BiST Vs. In-Circuit Sensors
By Susan Rambo - 13 May, 2020 - Comments: 0

Monitoring the health of a chip post-manufacturing, including how it is aging and performing over time, is becoming much more important as ICs make their way into safety-critical applications such as the central brain in automobiles. Faced with longer lifespans and a growing body of functional safety rules, systems vendors need to be able to predict when a part will fail. But as sensing auto... » read more

Benefits Of In-Chip Thermal Sensing
By Richard McPartland - 22 Apr, 2020 - Comments: 0

The latest SoCs on advanced semiconductor nodes typically include a fabric of sensors spread across the die, and for good reason. But why and what are the benefits? This first blog of a three-part series explores some of the key applications for in-chip thermal sensing and why embedding in-chip monitoring IP is an essential step to maximize performance and reliability and minimize power, or a... » read more

Power Becomes Bigger Concern For Embedded Processors
By Ann Mutschler - 15 Apr, 2020 - Comments: 0

Power is emerging as the dominant concern for embedded processors even in applications where performance is billed as the top design criteria. This is happening regardless of the end application or the process node. In some high-performance applications, power density and thermal dissipation can limit how fast a processor can run. This is compounded by concerns about cyber and physical secur... » read more

Designing Ultra Low Power AI Processors
By Ann Mutschler - 09 Apr, 2020 - Comments: 0

AI chip design is beginning to shift direction as more computing moves to the edge, adding a level of sophistication and functionality that typically was relegated to the cloud, but in a power envelope compatible with a battery. These changes leverage many existing tools, techniques and best practices for chip design. But they also are beginning to incorporate a variety of new approaches tha... » read more

Data Center Hyperscaling
By Stephen Crosher - 09 Apr, 2020 - Comments: 0

As we move in to 2020 it’s clear that every sector of industry, including the semiconductor industry, will have a responsibility to address growing environmental concerns. We should be aware that as our sector underpins the growth in AI, 5G telecommunications, crypto-currency and high performance compute applications, it is predicted that by 2030 energy consumption attributable to data center... » read more

Reliability Challenges Grow For 5/3nm
By Ed Sperling And Susan Rambo - 07 Apr, 2020 - Comments: 0

Ensuring that chips will be reliable at 5nm and 3nm is becoming more difficult due to the introduction of new materials, new transistor structures, and the projected use of these chips in safety- and mission-critical applications. Each of these elements adds its own set of challenges, but they are being compounded by the fact that many of these chips will end up in advanced packages or modul... » read more

Designing Resilient Electronics
By Ann Mutschler - 18 Mar, 2020 - Comments: 0

Electronic systems in automobiles, airplanes and other industrial applications are becoming increasingly sophisticated and complex, required to perform an expanding list of functions while also becoming smaller and lighter. As a result, pressure is growing to design extremely high-performance chips with lower energy consumption and less sensitivity to harsh environmental conditions. If this ... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy