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Advances In EM Analysis And Design Flows For RF System Development


With the move toward higher frequencies and component densities, RF/mixed signal PCB systems and heterogeneous system-in-package (SiP) technologies are increasingly susceptible to delayed product development turnaround times that threaten delivery schedules. These delays often occur late in development during integration when components that met the design specifications fail to achieve the req... » read more

Complexity, Reliability And Cost


Peter Schneider, director of Fraunhofer's Engineering of Adaptive Systems Division, sat down with Semiconductor Engineering to talk about future challenges in complexity, time to market and reliability issues, advanced packaging architectures, and the impact of billions of connected devices. What follows are excerpts of that discussion. SE: What is the biggest challenge you see in the semico... » read more

Energy Efficient, IoT-Based Smart Home


"Smart Home" technology is the future of residential technology, designed to deliver and distribute a number of services inside and outside the house via networked devices in which all the different applications and the intelligence behind them are integrated and interconnected. These smart devices have the potential to share information with each other as long as they can access a broadband in... » read more