Chip Industry Technical Paper Roundup: Mar. 5


New technical papers added to Semiconductor Engineering’s library this week. [table id=201 /] » read more

Ultra-Low Power CiM Design For Practical Edge Scenarios


A technical paper titled “Low Power and Temperature-Resilient Compute-In-Memory Based on Subthreshold-FeFET” was published by researchers at Zhejiang University, University of Notre Dame, Technical University of Munich, Munich Institute of Robotics and Machine Intelligence, and the Laboratory of Collaborative Sensing and Autonomous Unmanned Systems of Zhejiang Province. Abstract: "Compute... » read more