Searching For Rare Earths

By Mark LaPedus - 17 Apr, 2014 - Comments: 2

The semiconductor industry is pre-occupied with several and expensive technologies at once. One the device side, the industry is looking at new chip architectures, such as 3D NAND, finFETs and stacked die. On the manufacturing front, there is 450mm technology, next-generation lithography (NGL) and new materials. And that’s just the tip of the iceberg. Another technology that deserve... » read more

NAND ATE Market Gets Testy

By Mark LaPedus - 06 Feb, 2014 - Comments: 0

The NAND flash memory market is undergoing big changes. As planar NAND moves further down the 1xnm node regime, suppliers are ramping up devices with new cell structures, interfaces and other features. And on top of that, 3D NAND is beginning to appear in the market. The next-generation NAND devices will enable new applications in the mobile and enterprise markets, but the chips themselves p... » read more

The Bumpy Road To 3D NAND

By Mark LaPedus - 23 Jan, 2014 - Comments: 1

The NAND flash memory market is dynamic, but it’s also sometimes predictable. Suppliers tend to roll out identical NAND flash chips and then scale them to smaller geometries. And NAND chip prices rise and fall, depending on the supply/demand equation at a given point. Going forward, though, the NAND market is expected to become less predictable, if not chaotic, amid a new and major technol... » read more

The Road Ahead for 2014: Semiconductors

By Brian Bailey - 23 Jan, 2014 - Comments: 1

Last week, Semiconductor Engineering examined the 2014 predictions from several thought leaders in the industry and published those predictions that related to general market trends. Many of those predictions require some advances in semiconductor technologies and fabrications capabilities. It is those predictions that will be examined in this part, followed next week by the predictions related... » read more

Applied To Buy TEL

By Mark LaPedus - 24 Sep, 2013 - Comments: 0

In a deal that could shake-up the fab tool landscape, Applied Materials has announced a definitive agreement to acquire rival Tokyo Electron Ltd. (TEL) in a stock deal valued at around $9.3 billion. Under the terms of the blockbuster deal, Applied Materials will own approximately 68% of the new company and TEL will own about 32%. The combined entities will have a new name, dual headquarter... » read more

What’s After 3D NAND?

By Mark LaPedus - 19 Sep, 2013 - Comments: 0

By Mark LaPedus Planar NAND flash memory is on its last scaling legs, with 3D NAND set to become the successor to the ubiquitous 2D technology. Samsung Electronics, for one, already has begun shipping the industry’s first 3D NAND device, a 24-level, 128-gigabit chip. In addition, Micron and SK Hynix shortly will ship their respective 3D NAND devices. But the Toshiba-SanDisk duo are the lo... » read more

ATE Market Changes With The Times

By Jeff Chappell - 15 Aug, 2013 - Comments: 0

By Jeff Chappell A declining PC market in recent years coupled with the continuing growth of mobile phones and tablets has meant changes throughout the semiconductor supply chain, and automated test equipment is no exception. For example, a decade ago memory test—namely DRAM—was a large market compared with that of nascent system-on-a-chip (SoC) testing. In fact, at the time some test e... » read more

The Week In Review: July 22

By Mark LaPedus - 22 Jul, 2013 - Comments: 0

By Mark LaPedus ASML Holding has been under pressure to bring extreme ultraviolet (EUV) lithography into mass production. EUV is still delayed. Now, in their latest roadmaps, leading-edge chipmakers are counting on ASML’s 300mm EUV scanner for insertion at the 10nm node. Yet, at the same time, ASML also is working on a 450mm version of the EUV tool. “EUV (on 300mm) is a higher priority th... » read more

Mixed Signals

By Mark LaPedus - 08 Jul, 2013 - Comments: 0

By Mark LaPedus Based on the various forecasts for semiconductor equipment, the mood is mixed at this week’s Semicon West trade show in San Francisco. In its mid-year forecast, for example, SEMI predicts that the semiconductor equipment market will reach $36.3 billion in 2013, down 1.7% over 2012. But the business is expected to rebound and reach $43.98 billion in 2014, a 21.2 percent inc... » read more

The Week In Review: July 8

By Mark LaPedus - 08 Jul, 2013 - Comments: 0

By Mark LaPedus Fab tool vendors this week will gather at the annual Semicon West trade show in San Francisco. The mood is expected to be both gloomy and upbeat, at least based on one new and mixed forecast. The semiconductor equipment market is projected to fall 7.4% in 2013, but it will grow 27.1% in 2014, according to VLSI Research. The forecast for semis is up 10% in 2013 and 8.3% growth i... » read more

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tag: NAND

Searching For Rare Earths

NAND ATE Market Gets Testy

The Bumpy Road To 3D NAND

The Road Ahead for 2014: Semiconductors

Applied To Buy TEL

What’s After 3D NAND?

ATE Market Changes With The Times

The Week In Review: July 22

Mixed Signals

The Week In Review: July 8

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