3D NAND Market Heats Up

By Mark LaPedus - 16 May, 2013 - Comments: 0

By Mark LaPedus It’s the tale of two promising and separate 3D chip architectures. One technology is slowly taking root, while the other one is heating up. 3D stacked-die using through-silicon vias (TSVs) is on the slower path. Advanced chip-stacking has several challenges and is still a few years away from mass production. In contrast, 3D NAND is heating up, as Samsung and SK Hynix are a... » read more

Experts At The Table: Issues In Metrology And Inspection

By Mark LaPedus - 06 May, 2013 - Comments: 0

By Mark LaPedus Semiconductor Manufacturing & Design sat down to discuss future metrology and inspection challenges with John Allgair, senior member of the technical staff at GlobalFoundries; Kevin Heidrich, vice president of marketing and business development at Nanometrics; Robert Newcomb, executive vice president at Qcept Technologies; and Shrinivas Shetty, vice president of marketing f... » read more

Experts At The Table: Issues In Metrology And Inspection

By Mark LaPedus - 29 Apr, 2013 - Comments: 0

Experts At The Table: Issues In Metrology And Inspection

By Mark LaPedus - 18 Apr, 2013 - Comments: 0

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tag: Nanometrics

3D NAND Market Heats Up

Experts At The Table: Issues In Metrology And Inspection

Experts At The Table: Issues In Metrology And Inspection

Experts At The Table: Issues In Metrology And Inspection