tag: National Institute for Materials Science

Demonstrating A Fully-2D-Material Based Device For Temperature Sensing In Cryogenic Regimes
By Technical Paper Link - 27 Jun, 2023 - Comments: 0

A technical paper titled “I-V-T Characteristics and Temperature Sensor Performance of a Fully-2D WSe2/MoS2 Heterojunction Diode at Cryogenic Temperatures” was published by researchers at Technische Universität Dresden, Institute of Ion Beam Physics and Materials Research, and National Institute for Materials Science. Abstract: "In this work, we demonstrate the usability of a fully-2D-mat... » read more

Chip Industry’s Technical Paper Roundup: Apr. 25
By Linda Christensen - 25 Apr, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=94 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us ... » read more

Optimizing The Growth And Transfer Process of Graphene (Cambridge, RWTH Aachen)
By Technical Paper Link - 21 Apr, 2023 - Comments: 0

A technical paper titled "Putting High-Index Cu on the Map for High-Yield, Dry-Transferred CVD Graphene" was published by researchers at University of Cambridge, RWTH Aachen University, and National Institute for Materials Science. Abstract: "Reliable, clean transfer and interfacing of 2D material layers are technologically as important as their growth. Bringing both together remains a ch... » read more

Research Bits: Nov. 15
By Jesse Allen - 15 Nov, 2022 - Comments: 0

Low temperature 3D bonding Scientists from Osaka University developed a new method for the direct three-dimensional bonding of copper electrodes using silver layers. The method works at low temperatures and does not require external pressure. "Our process can be performed under gentle conditions, at relatively low temperatures and without added pressure, but the bonds were able to withstand... » read more

Research Bits: Oct. 4
By Jesse Allen - 04 Oct, 2022 - Comments: 0

2D electrode for ultra-thin semiconductors Researchers from the Korea Institute of Science and Technology (KIST), Japan's National Institute for Materials Science, and Kunsan National University designed two-dimensional semiconductor-based electronic and logic devices, with electrical properties that can be selectively controlled through a new 2D electrode material, chlorine-doped tin diseleni... » read more

Research Bits: Aug. 16
By Jesse Allen - 16 Aug, 2022 - Comments: 0

Protein-based circuits Researchers from North Carolina State University and University of Cambridge created self-assembled, protein-based circuits that can perform simple logic functions and take advantage of an electron’s properties at quantum scales. A challenge in creating molecular circuits is the unreliability as circuit size decreases. At the quantum scale, electrons behave like wav... » read more

Technical Paper Round-Up: July 18
By Linda Christensen - 18 Jul, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=33 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a good fit fo... » read more

Brightening Intrinsically Dark Material
By Technical Paper Link - 12 Jul, 2022 - Comments: 0

New research paper titled "Brightening of a dark monolayer semiconductor via strong light-matter coupling in a cavity," from researchers at Carl von Ossietzky University of Oldenburg (Germany), University of Iceland, the University of Würzburg (Germany), Friedrich Schiller University (Germany), Arizona State University (USA) and the National Institute for Materials Science in Tsukuba (Japan) a... » read more

Research Bits: May 31
By Jesse Allen - 31 May, 2022 - Comments: 0

Carbon nanotube transistors Researchers from the National Institute for Materials Science, National University of Science and Technology, Emanuel Institute of Biochemical Physics, Chinese Academy of Sciences, National Institute of Advanced Industrial Science and Technology, University of Tokyo, Tianjin University, and Queensland University of Technology created transistors out of carbon nanotu... » read more

Technical Paper Round-up: May 17
By Linda Christensen - 17 May, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=27 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a go... » read more

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