tag: National Institute for Materials Science

Thinning of GaN-on-GaN HEMTs With A Laser Slicing Technique
By Technical Paper Link - 09 May, 2022 - Comments: 0

New technical paper "Laser slice thinning of GaN-on-GaN high electron mobility transistors" from researchers at Nagoya University, Hamamatsu Photonics, and National Institute for Materials Science, Tsukuba. Abstract "As a newly developed technique to slice GaN substrates, which are currently very expensive, with less loss, we previously reported a laser slicing technique in this journal. In... » read more

Manufacturing Bits: Dec. 28
By Mark LaPedus - 28 Dec, 2021 - Comments: 1

Measuring microdroplets The National Institute of Standards and Technology (NIST) has found a new way for microscopes to measure the volumes of microdroplets. Using this technique, NIST has measured the volume of individual droplets smaller than 100 trillionths of a liter with an uncertainty of less than 1%. That represents a tenfold improvement compared to previous measurements, according ... » read more

Semiconductor nanochannels in metallic carbon nanotubes by thermomechanical chirality alteration
By Technical Paper Link - 23 Dec, 2021 - Comments: 0

Abstract: "Carbon nanotubes have a helical structure wherein the chirality determines whether they are metallic or semiconducting. Using in situ transmission electron microscopy, we applied heating and mechanical strain to alter the local chirality and thereby control the electronic properties of individual single-wall carbon nanotubes. A transition trend toward a larger chiral angle region wa... » read more

Dual Surface Architectonics for Directed Self‐Assembly of Ultrahigh‐Resolution Electronics
By Technical Paper Link - 11 Oct, 2021 - Comments: 0

Abstract: "The directed self‐assembly of electronic circuits using functional metallic inks has attracted intensive attention because of its high compatibility with extensive applications ranging from soft printed circuits to wearable devices. However, the typical resolution of conventional self‐assembly technologies is not sufficient for practical applications in the rapidly evolving addi... » read more

Power/Performance Bits: Oct. 11
By Jesse Allen - 11 Oct, 2021 - Comments: 0

Finer printed circuits Researchers from the National Institute for Materials Science in Japan, Jiangnan University, Zhengzhou University, Senju Metal Industry Co., and C-INK Co. developed a way to print smaller features for printed electronics. The directed self-assembly method increases the chemical polarity of predetermined areas on a surface, which promoted selective adhesion of metallic na... » read more

Power/Performance Bits: Aug. 9
By Jesse Allen - 09 Aug, 2021 - Comments: 0

Capacitors in interposers Scientists at Tokyo Institute of Technology developed a 3D functional interposer containing an embedded capacitor. They tout the design as saving package area and reducing wiring length, resulting in less noise and power consumption. The capacitive elements are embedded inside a 300mm silicon piece using permanent adhesive and mold resin. The interconnects between ... » read more

Power/Performance Bits: March 8
By Jesse Allen - 08 Mar, 2021 - Comments: 0

Non-toxic, printable piezoelectric Researchers at RMIT University and University of New South Wales developed a flexible and printable piezoelectric material that could be used in self-powered electronics including wearables and implantables. "Until now, the best performing nano-thin piezoelectrics have been based on lead, a toxic material that is not suitable for biomedical use," said Dr N... » read more

Power/Performance Bits: March 2
By Jesse Allen - 02 Mar, 2021 - Comments: 0

Fast-charging EV battery Electric vehicle adoption faces challenges from consumers' range anxiety and the extended lengths of time needed to charge a car's battery. Researchers at Pennsylvania State University are trying to address this by developing lithium iron phosphate EV batteries that have a range of 250 miles with the ability to charge in 10 minutes. It also is expected to have a lifeti... » read more

Manufacturing Bits: Jan. 5
By Mark LaPedus - 05 Jan, 2021 - Comments: 0

Gallium oxide chips The National Renewable Energy Laboratory (NREL), the Colorado School of Mines, and Saint-Gobain Crystals have teamed up to develop manufacturing technologies and devices based on an emerging material called gallium oxide. This work is part of a three-year program, dubbed the Oxide Electronic Devices for Extreme Operating Environments project, which is funded by the U.S. ... » read more

Power/Performance Bits: July 28
By Jesse Allen - 28 Jul, 2020 - Comments: 0

Programmable photonics Researchers from the University of Southampton developed a method for making programmable  integrated switching units on a silicon photonics chip. By using a generic optical circuit that can be fabricated in bulk then later programmed for specific applications, the team hopes to reduce production costs. "Silicon photonics is capable of integrating optical devices and... » read more

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