Week In Review: Manufacturing, Test

By Karen Heyman and Anne Meixner - 30 Sep, 2022 - Comments: 0

Highlights from ITC The hot topic at this week’s International Test Conference (ITC) was tackling silent data corruption, with panel discussions, papers, and Google’s Parthasarathy Ranganathan’s keynote address all emphasizing the urgency of the issue. In the past two years Meta, Google, and Microsoft have reported on silent errors, errors not detected at test, which are adversely impact... » read more

There Is Plenty Of Room At The Top: Imagining Miniaturized Electro-Mechanical Switches In Low-Power Computing Applications

By Gerold Schröpfer - 19 May, 2022 - Comments: 0

The first computers were built using electro-mechanical components, unlike today’s modern electronic systems. Alan Turing’s cryptanalysis multiplier and Konrad Zuse’s Z2 were invented and built in the first half of the 20th century, and were among the first computers ever constructed. Electro-mechanical switches and relays performed logic operations in these machines. Even after computers... » read more

Design of strongly nonlinear graphene nanoelectromechanical systems in quantum regime

By Technical Paper Link - 10 Jan, 2022 - Comments: 0

ABSTRACT "We report on the analysis and design of atomically thin graphene resonant nanoelectromechanical systems (NEMS) that can be engineered to exhibit anharmonicity in the quantum regime. Analysis of graphene two-dimensional (2D) NEMS resonators suggests that with device lateral size scaled down to ∼10–30 nm, restoring force due to the third-order (Duffing) stiffness in graphene NE... » read more

Reaching silicon-based NEMS performances with 3D printed nanomechanical resonators

By Technical Paper Link - 19 Oct, 2021 - Comments: 0

Abstract: "The extreme miniaturization in NEMS resonators offers the possibility to reach an unprecedented resolution in high-performance mass sensing. These very low limits of detection are related to the combination of two factors: a small resonator mass and a high quality factor. The main drawback of NEMS is represented by the highly complex, multi-steps, and expensive fabrication process... » read more

Manufacturing Bits: Aug. 5

By Mark LaPedus - 05 Aug, 2019 - Comments: 0

Chemical weapon sensors Using nanoelectromechanical system (NEMS) technologies and other parts, Sandia National Laboratories has developed a tiny gas chromatograph sensor for use in detecting toxic gases and chemical weapons. Chemical identification involves the use of various instruments and systems. Larger systems are used in the lab. A portable version, called a mass spectrometer, is ava... » read more

Challenges At Advanced Nodes

By Ed Sperling - 23 Jul, 2015 - Comments: 1

Semiconductor Engineering sat down to discuss finFETs, 22nm FD-SOI and how the how the market will segment over the next few years with Marie Semeria, CEO of [getentity id="22192" e_name="Leti"]; Patrick Soheili, vice president of product management and corporate development at [getentity id="22242" e_name="eSilicon"]; Paul Boudre, CEO of Soitec; and Subramani Kengeri, vice president of global ... » read more

What Comes After FinFETs?

By Ed Sperling - 16 Aug, 2012 - Comments: 0

By Mark LaPedus The semiconductor industry is currently making a major transition from conventional planar transistors to finFETs starting at 22nm. The question is what’s next? In the lab, IBM, Intel and others have demonstrated the ability to scale finFETs down to 5nm or so. If or when finFETs runs out of steam, there are no less than 18 different next-generation candidates that could o... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer