Week In Review: Design, Low Power

By Jesse Allen - 09 Jun, 2023 - Comments: 0

Renesas Electronics completed its acquisition of Panthronics, a fabless company specializing in near-field communication (NFC) wireless products. Renesas has already incorporated Panthronics NFC technology into several solution reference designs for applications such as payment, IoT, asset tracking, and smart meters. The European Commission announced new funding for the semiconductor and mic... » read more

A Methodology for Automatic eFPGA redaction

By Technical Paper Link - 20 May, 2022 - Comments: 0

New academic paper titled "ALICE: An Automatic Design Flow for eFPGA Redaction" from researchers at Politecnico di Milano, New York University, University of Calgary, and the University of Utah. Abstract "Fabricating an integrated circuit is becoming unaffordable for many semiconductor design houses. Outsourcing the fabrication to a third-party foundry requires methods to protect the intell... » read more

Manufacturing Bits: Sept. 14

By Mark LaPedus - 14 Sep, 2021 - Comments: 0

Probabilistic computers Sandia National Laboratories and others are developing what researchers call a probabilistic computer. Instead of traditional computing, Sandia is developing a system with built-in randomness that computes information differently every time. As part the research program, the Department of Energy awarded the project $6 million over the next three years to develop t... » read more

Manufacturing Bits: Jan. 29

By Mark LaPedus - 29 Jan, 2019 - Comments: 1

Thermal lithography Using a technique called thermal scanning probe lithography, New York University (NYU) and others have reported a breakthrough in fabricating 2D semiconductors. With the technology, researchers have devised metal electrodes with vanishing Schottky barriers on 2D semiconductors based on molybdenum disulfide (MoS₂). Thermal scanning probe lithography, sometimes called t-... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 30 Nov, 2018 - Comments: 0

Internet of Things Lowe’s, the home improvement retailer, is giving up on the smart home market. The company is putting its Iris Smart Home business up for sale as part of a reorganization. The retailer made a big splash at CES 2015 with its Innovation Lab offerings, which included retail service robots and the Holoroom “home improvement simulator.” The Iris product line includes multipl... » read more

Power/Performance Bits: Dec. 12

By Jesse Allen - 12 Dec, 2017 - Comments: 0

Sunny days slow 5G 5G networks promise a world of fast wireless data speeds and connected everything. However, researchers at Embry-Riddle Aeronautical University and King Saud University found that hot, sunny weather could degrade 5G cellular transmissions by more than 15%. The researchers focused on how solar radio emissions would affect the unlicensed 60 GHz bands, part of the millimet... » read more

Emerging Security Protocols

By Ernest Worthman - 06 Aug, 2015 - Comments: 0

As the proliferation of mobile devices ramps up at escalating rates, securing these devices and the infrastructure they run on is becoming a top priority for both the hardware and the data that swirls within it. Traditional security platforms such as firewalls and antivirus programs are still a viable part of the security envelope, but the rapid emergence of zero-day/hour threats is somethin... » read more

Newer posts →

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer