tag: NIST

Chip Industry’s Technical Paper Roundup: Mar. 28
By Linda Christensen - 28 Mar, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=89 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us p... » read more

Week In Review: Manufacturing, Test
By Karen Heyman - 24 Mar, 2023 - Comments: 0

TEL announced plans to build a ¥2.2 billion ($168.2 million) production and logistics center at its Tohoku Office to increase capacity. Construction of the 57,000m² facility, which will be used for manufacturing thermal processing and single-wafer deposition systems, is slated to start in spring 2024, and expected to be completed in fall 2025. Toshiba's board voted in favor of a 2 trillio... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 24 Mar, 2023 - Comments: 0

Automotive, mobility Ford expects to lose $3 billion from EV sales this year, but said that part of the business will begin generating profits soon. The company still expects to hit its overall profit numbers for the year, however. Volvo is making a new electric vehicle (EV) in China and exporting it to Europe and Japan, according to a Nikkei Asia interview. Volvo is owned by Zhejiang Geely... » read more

Easy-To-Use Mechanical Frequency Comb Platform (TU Delft)
By Technical Paper Link - 23 Mar, 2023 - Comments: 0

A new technical paper titled "Mechanical overtone frequency combs" was published by researchers at Delft University of Technology, Ahmedabad University and NIST. Abstract "Mechanical frequency combs are poised to bring the applications and utility of optical frequency combs into the mechanical domain. So far, their main challenge has been strict requirements on drive frequencies and power,... » read more

Research Bits: March 21
By Jesse Allen - 21 Mar, 2023 - Comments: 0

Micropatterning with sugar A scientist at the National Institute of Standards and Technology (NIST) discovered a transfer printing process that can deposit microcircuit patterns on curved and textured surfaces using sugar candy. Transfer printing methods, such as flexible tapes, are often used for surfaces that are difficult to directly print on. But they have difficulty with conforming to ... » read more

Chip Industry’s Technical Paper Roundup: Mar. 21
By Linda Christensen - 21 Mar, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=88 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us ... » read more

New Spintronics Manufacturing Process, Allowing Scaling Down To Sub-5nm (U. of Minnesota/NIST)
By Technical Paper Link - 20 Mar, 2023 - Comments: 0

A new technical paper titled "Sputtered L10-FePd and its Synthetic Antiferromagnet on Si/SiO2 Wafers for Scalable Spintronics" was published by researchers at University of Minnesota and NIST, with funding by DARPA and others. According to a University of Minnesota summary news article, "The industry standard spintronic material, cobalt iron boron, has reached a limit in its scalability. The... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 17 Mar, 2023 - Comments: 0

North Americas’s first zero-emission hydrogen-powered “Train de Charlevoix” will start running in Canada this summer, with speeds up to 85 mph, only emitting water vapor. Germany rolled out the world’s first passenger train fleet in 2022. The U.S. Department of Energy announced the availability of $750 million for R&D to further clean hydrogen technologies, part of the Biparti... » read more

Chip Industry’s Technical Paper Roundup: Mar. 14
By Linda Christensen - 14 Mar, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=86 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us ... » read more

Hardware-Based Confidential Computing (NIST)
By Technical Paper Link - 10 Mar, 2023 - Comments: 0

NIST has published a draft report, titled “Hardware Enabled Security: Hardware-Based Confidential Computing,” which presents an approach for managing machine identities for protection against malware and other security vulnerabilities. Comments are due April 10, 2023. Abstract "Organizations employ a growing volume of machine identities, often numbering in the thousands or millions per ... » read more

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