tag: NIST

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 17 Mar, 2023 - Comments: 0

North Americas’s first zero-emission hydrogen-powered “Train de Charlevoix” will start running in Canada this summer, with speeds up to 85 mph, only emitting water vapor. Germany rolled out the world’s first passenger train fleet in 2022. The U.S. Department of Energy announced the availability of $750 million for R&D to further clean hydrogen technologies, part of the Biparti... » read more

Chip Industry’s Technical Paper Roundup: Mar. 14
By Linda Christensen - 14 Mar, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=86 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us ... » read more

Hardware-Based Confidential Computing (NIST)
By Technical Paper Link - 10 Mar, 2023 - Comments: 0

NIST has published a draft report, titled “Hardware Enabled Security: Hardware-Based Confidential Computing,” which presents an approach for managing machine identities for protection against malware and other security vulnerabilities. Comments are due April 10, 2023. Abstract "Organizations employ a growing volume of machine identities, often numbering in the thousands or millions per ... » read more

Week In Review: Auto, Security, Pervasive Computing
By Linda Christensen - 10 Mar, 2023 - Comments: 0

Rambus will begin selling Arm's CryptoCell embedded security platform and CryptoIsland root-of-trust cores, setting the stage for a much broader push by Rambus into security for a wide range of connected devices, and ultimately into security as a service. Under the terms of the deal, Rambus' customers will be able to license Arm IP directly from Rambus. For Arm's existing customers, there will ... » read more

Week In Review: Semiconductor Manufacturing, Test
By Gregory Haley - 03 Mar, 2023 - Comments: 0

Semiconductor Research Corporation (SRC) released an interim roadmap for Microelectronic and Advanced Packaging Technologies (MPAT) that targets 10- to 15-year goals for 3D integration and multi-chiplet packaging. The roadmap is open for comments. Participants in the MPAT include AMD, IBM, Intel, Texas Instruments, Purdue University, SUNY Binghamton and the Georgia Institute of Technology. It i... » read more

Securing IoT Devices With Lightweight Cryptography
By Bart Stevens - 02 Mar, 2023 - Comments: 0

The National Institute of Standards and Technology (NIST) recently announced the selection of a new family of cryptographic algorithms called ASCON, which have been developed for lightweight cryptography applications. In this blog, we will explore what lightweight cryptography is and why it is worth considering for specific Internet of Things (IoT) use cases. In summary, lightweight cryptogr... » read more

Security Highlight: Ascon
By Marc Witteman - 02 Mar, 2023 - Comments: 0

The contest for standardization of a lightweight crypto (LWC) algorithm has just finished. US standards body NIST selected Ascon as the winner. Ascon is an algorithm proposed by an international team of scientists that delivers strong performance and security at a low cost. How does that work? Lightweight crypto is symmetric encryption technology, that runs well on constrained systems, lik... » read more

Lightweight Cryptography: An Introduction
By Rambus - 02 Mar, 2023 - Comments: 0

The National Institute of Standards and Technology (NIST) announced on February 7, 2023, that it had selected the ASCON algorithm to become the standard for Lightweight Cryptography. In this whitepaper, we will explore what lightweight cryptography is and why it is worth considering for specific Internet of Things (IoT) use cases. Download this white paper to learn: What lightweight cry... » read more

U.S. Opens Funding Applications Under CHIPS Act
By Linda Christensen - 28 Feb, 2023 - Comments: 0

The 2022 Chips and Science Act provided $39 billion in federal funding to revitalize the U.S. semiconductor industry. Now, the U.S. Department of Commerce, the oversight branch for the CHIPS Act, has taken the first step in opening up applications for this funding. This initial funding opportunity focuses on applications specifically for projects to “construct, expand, or modernize commerc... » read more

Week In Review: Auto, Security, Pervasive Computing
By Marie C. Baca - 24 Feb, 2023 - Comments: 0

Automotive Ambarella will use Samsung's 5nm process technology for its new CV3-AD685 automotive AI central domain controller, bringing "new levels of AI acceleration, system integration and power efficiency to ADAS and L2+ through L4 autonomous vehicles.” Renesas introduced four technologies for automotive communication gateway SoCs: (1) an architecture that dynamically changes... » read more

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