Chip Industry’s Technical Paper Roundup: Mar. 14

RISC-V virtualization; hexagonal boron nitride for enhanced graphene device array; human–machine collaboration for improving process development; NIST HW-based confidential computing; ferroelectric HEMT; SpGEMM with RISC-V vector instructions; wafer defects; reducing contact resistance on 2D transistors; approximate accelerators in FPGA-based systems.

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New technical papers recently added to Semiconductor Engineering’s library:

Technical Paper Research Organizations
CVA6 RISC-V Virtualization : Architecture, Microarchitecture, and Design Space Exploration Universidade do Minho, University of Bologna, and ETH Zurich
Optimization of SpGEMM with Risc-V vector instructions Barcelona Supercomputing Center
WS2 Transistors with Sulfur Atoms Being Replaced at the Interface: First-Principles Quantum-Transport Study National Yang Ming Chiao Tung University
Fully epitaxial, monolithic ScAlN/AlGaN/GaN ferroelectric HEMT University of Michigan
SEMI-PointRend: Improved Semiconductor Wafer Defect Classification and Segmentation as Rendering imec, University of Ulsan, and KU Leuven
autoXFPGAs: An End-to-End Automated Exploration Framework for Approximate Accelerators in FPGA-Based Systems TU Wien, Brno University of Technology, and NYUAD
Hardware Enabled Security: Hardware-Based Confidential Computing NIST
Human–machine collaboration for improving semiconductor process development Lam Research
Large-area synthesis and transfer of multilayer hexagonal boron nitride for enhanced graphene device arrays Kyushu University, National Institute of Advanced Industrial Science and Technology (AIST), and Osaka University

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