Week In Review: Auto, Security, Pervasive Computing


Automotive, Mobility Automotive chip shortages will continue until 2025, according to reports in a Financial Times (FT) article. Demand for SiC power chips will remain high. Onsemi reportedly is already sold out of the power semiconductors. Archer Aviation’s Midnight eVTOL (electric vertical take-off and landing) is listed in the Federal Register now by The U.S. Federal Aviation Administr... » read more

Research Bits: Dec. 13


Electronic-photonic interface for data centers Engineers at Caltech and the University of Southampton integrated an electronic and photonic chip for high-speed communication in data centers. "There are more than 2,700 data centers in the U.S. and more than 8,000 worldwide, with towers of servers stacked on top of each other to manage the load of thousands of terabytes of data going in and o... » read more

Chip Industry’s Technical Paper Roundup: Dec. 13


New technical papers added to Semiconductor Engineering’s library this week.[table id=70 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us po... » read more

HW-Enabled Security Techniques To Improve Platform Security And Data Protection For Cloud Data Centers And Edge Computing (NIST)


A technical paper titled "Hardware-Enabled Security: Enabling a Layered Approach to Platform Security for Cloud and Edge Computing Use Cases" was published by NIST, Intel, AMD, Arm, IBM, Cisco and Scarfone Cybersecurity. Abstract: "In today’s cloud data centers and edge computing, attack surfaces have shifted and, in some cases, significantly increased. At the same time, hacking has becom... » read more

Chip Industry’s Technical Paper Roundup: Nov. 29


New technical papers added to Semiconductor Engineering’s library this week. [table id=66 /]   Related Reading: Chip Industry’s Technical Paper Roundup: Nov. 21 New papers: lithography modeling; solving Rowhammer; energy-efficient batch normalization HW; 3-to-1 reconfigurable analog signal modulation circuit; lateral double magnetic tunnel junction; reduce branch mispredic... » read more

Phononic and Magnonic Properties of 1D MoI3 Nanowires


A new technical paper titled "Elemental excitations in MoI3 one-dimensional van der Waals nanowires" was published by researchers at NIST, UC Riverside, University of Georgia, Theiss Research Inc, and Stanford University. "We described here the elemental excitations in crystals of MoI3 a vdW [van der Waals] material with a true-1D crystal structure. Our measurements reveal anomalous temperat... » read more

Week In Review: Semiconductor Manufacturing, Test


Chinese memory chip maker YMTC and dozens of other Chinese entities are "at risk" of being added to a trade blacklist as soon as Dec. 6, a U.S. Commerce Department official said in prepared remarks seen by Reuters. SMIC co-CEO Zhao Haijun said on an earnings call that recent export controls from the United States will have an "adverse impact" on the company's production. The U.K. has rule... » read more

Post-Quantum And Pre-Quantum Security Issues Grow


General-purpose quantum computers will be able to crack the codes that protect much of the world’s information, and while these machines don’t exist yet, security experts say governments and businesses are starting to prepare for encryption in a post-quantum world. The task is made all the more challenging because no one knows exactly how future quantum machines will work, or even which mat... » read more

Research Bits: Nov. 1


Atomic-level rare earth manipulation Scientists from Ohio University, Argonne National Laboratory, and the University of Illinois at Chicago have rotated a single, charged rare earth molecule on a metal surface without changing the charge. The team used scanning tunneling microscopy (STM) system to rotate a positively charged Europium base molecule with negatively charged counterions as a p... » read more

Week In Review: Semiconductor Manufacturing, Test


Fallout from the new U.S. export controls continues. Under new regulations, companies looking to supply Chinese chipmakers with advanced manufacturing equipment (<14nm) must first obtain a license from the U.S. Department of Commerce. In addition, U.S. persons (citizens and permanent residents) are barred from supporting China’s advanced chip development or production without a license. ... » read more

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