tag: NIST

Research Bits: Jan. 24
By Jesse Allen - 24 Jan, 2023 - Comments: 0

Transistor-free compute-in-memory Researchers from the University of Pennsylvania, Sandia National Laboratories, and Brookhaven National Laboratory propose a transistor-free compute-in-memory (CIM) architecture to overcome memory bottlenecks and reduce power consumption in AI workloads. "Even when used in a compute-in-memory architecture, transistors compromise the access time of data," sai... » read more

Chip Industry’s Technical Paper Roundup: Jan 3
By Linda Christensen - 03 Jan, 2023 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=72 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us ... » read more

Multi-Wavelength, Multimode Communication Scheme For On-Chip and Chip-to-Chip Interconnects
By Technical Paper Link - 02 Jan, 2023 - Comments: 0

A technical paper titled "Multi-dimensional data transmission using inverse-designed silicon photonics and microcombs" was published by researchers at Stanford, Harvard, University of Central Florida, NIST, and others. "Here we demonstrate an integrated multi-dimensional communication scheme that combines wavelength- and mode- multiplexing on a silicon photonic circuit. Using foundry-compati... » read more

Week In Review: Semiconductor Manufacturing, Test
By Karen Heyman - 22 Dec, 2022 - Comments: 0

SEMI , SEMI Europe and European Commission representatives, in consultation with semiconductor industry stakeholders, proposed initiatives to overcome the skills shortage in Europe’s microelectronics industry: Create an industry image campaign to raise public awareness on how technology is shaping the future, and how workers can establish careers in the semiconductor industry. Remove ... » read more

Week In Review: Design, Low Power
By Marie C. Baca - 22 Dec, 2022 - Comments: 0

RISC-V The European Union said it will spend the equivalent of $286.5 million on a high performance computing ecosystem based on RISC-V. According to the call for proposals, the aim of the project is to “establish a partnership between the EuroHPC JU and a consortium of industry, research organizations and institutions in HPC to the development of innovative HPC hardware and software technol... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 22 Dec, 2022 - Comments: 0

Automotive, Mobility Automotive chip shortages will continue until 2025, according to reports in a Financial Times (FT) article. Demand for SiC power chips will remain high. Onsemi reportedly is already sold out of the power semiconductors. Archer Aviation’s Midnight eVTOL (electric vertical take-off and landing) is listed in the Federal Register now by The U.S. Federal Aviation Administr... » read more

Research Bits: Dec. 13
By Jesse Allen - 13 Dec, 2022 - Comments: 0

Electronic-photonic interface for data centers Engineers at Caltech and the University of Southampton integrated an electronic and photonic chip for high-speed communication in data centers. "There are more than 2,700 data centers in the U.S. and more than 8,000 worldwide, with towers of servers stacked on top of each other to manage the load of thousands of terabytes of data going in and o... » read more

Chip Industry’s Technical Paper Roundup: Dec. 13
By Linda Christensen - 13 Dec, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week.[table id=70 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us po... » read more

HW-Enabled Security Techniques To Improve Platform Security And Data Protection For Cloud Data Centers And Edge Computing (NIST)
By Technical Paper Link - 06 Dec, 2022 - Comments: 0

A technical paper titled "Hardware-Enabled Security: Enabling a Layered Approach to Platform Security for Cloud and Edge Computing Use Cases" was published by NIST, Intel, AMD, Arm, IBM, Cisco and Scarfone Cybersecurity. Abstract: "In today’s cloud data centers and edge computing, attack surfaces have shifted and, in some cases, significantly increased. At the same time, hacking has becom... » read more

Chip Industry’s Technical Paper Roundup: Nov. 29
By Linda Christensen - 29 Nov, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=66 /]   Related Reading: Chip Industry’s Technical Paper Roundup: Nov. 21 New papers: lithography modeling; solving Rowhammer; energy-efficient batch normalization HW; 3-to-1 reconfigurable analog signal modulation circuit; lateral double magnetic tunnel junction; reduce branch mispredic... » read more

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