tag: NIST

Summary Of The Progress In Beta-Phase Gallium Oxide Field-Effect Transistors
By Technical Paper Link - 11 Jan, 2024 - Comments: 0

A technical paper titled “Progress in Gallium Oxide Field-Effect Transistors for High-Power and RF Applications” was published by researchers at George Mason University and National Institute of Standards and Technology (NIST). Abstract: "Power electronics are becoming increasingly more important, as electrical energy constitutes 40% of the total primary energy usage in the USA and is exp... » read more

Chip Industry Week In Review
By The SE Staff - 22 Dec, 2023 - Comments: 0

By Jesse Allen, Karen Heyman, and Liz Allan More than 1 billion generative AI smartphones are expected be shipped during 2024 to 2027, reports Counterpoint. The share of GenAI smartphones will be 4% of the market in 2023 and is likely to double in 2024, with Samsung capturing half the market, followed by Chinese OEMs. By 2027, GenAI smartphones could account for 40% of the market. Global ... » read more

Proprietary Vs. Commercial Chiplets
By Ed Sperling - 19 Dec, 2023 - Comments: 0

Large chipmakers are focusing on chiplets as the best path forward for integrating more functions into electronic devices. The challenge now is how to pull the rest of the chip industry along, creating a marketplace for third-party chiplets that can be chosen from a menu using specific criteria that can speed time to market, help to control costs, and behave as reliably as chiplets developed in... » read more

Chip Industry Technical Paper Roundup: Dec 18
By Linda Christensen - 18 Dec, 2023 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=176 /] More ReadingTechnical Paper Library home » read more

Chip Industry Week In Review
By The SE Staff - 15 Dec, 2023 - Comments: 0

By Jesse Allen, Gregory Haley, and Liz Allan Synopsys acquired Imperas, pushing further into the RISC-V world with Imperas' virtual platform technology for verifying and emulating processors. Synopsys has been building up its RISC-V portfolio, starting with ARC-V processor IP and a full suite of tools introduced last month. The first high-NA EUV R&D center in the U.S. will be built at... » read more

2D Computing Magnets For Temperatures Up To 170-Degrees Fahrenheit
By Technical Paper Link - 12 Dec, 2023 - Comments: 0

A technical paper titled “Magnetic properties of intercalated quasi-2D Fe3-xGeTe2 van der Waals magnet” was published by researchers at University of Texas at El Paso, National Institute of Standards and Technology (NIST), University of Edinburgh, Donostia International Physics Centre (DIPC), Hampton University, and Brookhaven National Laboratory. Abstract: "Among several well-kno... » read more

Chip Industry Week In Review
By The SE Staff - 01 Dec, 2023 - Comments: 0

By Susan Rambo, Gregory Haley, and Liz Allan Amkor plans to invest about $2 billion in a new advanced packaging and test facility in Peoria, Arizona. When finished, it will employ about 2,000 people and will be the largest outsourced advanced packaging facility in the U.S. The first phase of the construction is expected to be completed and operational within two to three years. Synopsys p... » read more

Chip Industry Week In Review
By The SE Staff - 22 Nov, 2023 - Comments: 0

By Jesse Allen, Susan Rambo, and Liz Allan The U.S. government will invest about $3 billion for the National Advanced Packaging Manufacturing Program (NAPMP), including an advanced packaging piloting facility to help U.S. manufacturers adopt new technology and workforce training programs. It also will provide funding for projects concentrating on materials and substrates; equipment, tools, ... » read more

Chip Industry Week In Review
By The SE Staff - 03 Nov, 2023 - Comments: 0

By Susan Rambo, Gregory Haley, Jesse Allen, and Liz Allan President Biden issued an executive order on the “Safe, Secure, and Trustworthy Development and Use of Artificial Intelligence.” It says entities need to report large-scale computing clusters and the total computing power available, including “any model that was trained using a quantity of computing power greater than 1,026 inte... » read more

Research Bits: October 31
By Susan Rambo - 31 Oct, 2023 - Comments: 0

Skinlike sensor for robots University of British Columbia engineers with help from researchers from Frontier Robotics, Honda research institute, created a soft sensor that approximates skin. Mostly made of silicone rubber, the sensor uses weak electric fields to sense objects, even at a distance, and can detect forces into and along its surface. The sensor could provide touch sensitivity and d... » read more

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