Redefining A System…And Why It Matters

By Ed Sperling - 23 Oct, 2014 - Comments: 0

The concept of a system on chip has been around since the mid-1990s, but the actual mass implementation of this scheme is almost synonymous with the rise of the smart phone over the past decade. Put in perspective, it isn't that old, and it's about to change. Prior to the [getkc id="81" kc_name="SoC"], an electronic system was largely a collection of components on a PCB that included memory,... » read more

Manufacturing Bits: Sept. 2

By Mark LaPedus - 02 Sep, 2014 - Comments: 0

Looking at space dust The first analysis of space dust, collected by a special collector onboard NASA's Stardust mission and sent back to Earth for study in 2006, is more complex in composition and structure than previously thought. Researchers examined the dust using synchrotron light sources from three groups--the U.S. Department of Energy's Argonne National Laboratory, Lawrence Berkeley... » read more

Under One Roof

By Ed Sperling - 12 Sep, 2013 - Comments: 0

By Ed Sperling Microsoft’s decision to buy Nokia’s phone business, Apple’s move to build its own chips to more effectively run its software, and Google’s effort to develop its own hardware for next-generation platforms such as Google Glass mark an interesting reversal in the electronics industry. Disaggregation was the answer to slow-moving giants such as big-iron companies. Startin... » read more

The Week In Review: Sept. 9

By Mark LaPedus - 09 Sep, 2013 - Comments: 0

By Mark LaPedus SK Hynix’ DRAM fab in China caught on fire. The fire caused one minor injury, but it did not impact the equipment, according to reports. SK Hynix will re-open the fab soon, according to reports. Bob Halliday, Applied Materials’ CFO, gave a presentation at an analyst event, saying: “I think there’s probably more technology inflections going on right now than in years.... » read more

Performance Or Power?

By Ed Sperling - 06 Sep, 2013 - Comments: 0

For high-volume chips, such as those slated for mobile devices such as tablets or smart phones, energy efficiency is absolutely critical. For very high-value chips, which are the ones that show up in PCs or servers, the focus is more on performance and how efficiently that performance is obtained. And for the stuff in the middle, notably the Internet of things, the commodity servers and automot... » read more

A Brief History Of Power Formats

By Barry Pangrle - 09 Feb, 2012 - Comments: 0

Barry Pangrle A lot has happened in the industry in the way of power format standards over the past seven years. I’m going to attempt to hit on some of the highlights over that time period, especially with regards to the “Big 3” EDA vendors to hopefully put it all into better context for our readers. Early on, circa 2005, Mentor Graphics was working on a power format referred to as th... » read more

Preparing For 3D IC Stacking

By Ed Sperling - 22 Jul, 2010 - Comments: 0

By David Lammers Through-silicon vias (TSVs) are in various stages of late development, but design and manufacturing challenges remain before companies can gain the full benefits of the third dimension. Two camps are pushing hard to introduce TSVs—the design community and the manufacturing equipment companies. The initial goal is to connect graphics memories to graphics processors in mobi... » read more

Pulling Power Out Of Thin Air

By Ed Sperling - 17 Sep, 2009 - Comments: 0

By Cheryl Ajluni It wasn’t all that long ago that voice communication via a traditional landline was the norm. At the time, consumers would have been hard pressed to imagine a world in which anytime, anywhere communication (voice and data) with a device no bigger than the human hand was possible. Many of those same consumers might today find it hard to conceive of a world in which their... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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