tag: Northrop Grumman

Chiplet Momentum Rising
By Mark LaPedus - 26 Feb, 2020 - Comments: 0

The chiplet model is gaining momentum as an alternative to developing monolithic ASIC designs, which are becoming more complex and expensive at each node. Several companies and industry groups are rallying around the chiplet model, including AMD, Intel and TSMC. In addition, there is a new U.S. Department of Defense (DoD) initiative. The goal is to speed up time to market and reduce the cost... » read more

Week In Review: Design, Low Power
By Jesse Allen - 29 Mar, 2019 - Comments: 0

ON Semiconductor will acquire Quantenna Communications for $24.50 per share in an all cash transaction, representing an equity value of approximately $1.07 billion and enterprise value of approximately $936 million. Quantenna, a maker of Wi-Fi chipsets, was founded in 2006 and went public in late 2016. Tools & IP Achronix completed testing and is now demonstrating the 112 Gbps SerDes th... » read more

The Chiplet Race Begins
By Mark LaPedus - 06 Aug, 2018 - Comments: 1

Momentum is building for the development of advanced packages and systems using so-called chiplets, but the technology faces some challenges in the market. A group led by DARPA, as well as Marvell, zGlue and others are pursuing chiplet technology, which is a different way of integrating multiple dies in a package or system. In fact, the Defense Advanced Research Projects Agency (DARPA), part... » read more

Manufacturing Bits: Jan. 30
By Mark LaPedus - 30 Jan, 2018 - Comments: 0

SRC’s new R&D centers The Semiconductor Research Corp. has launched a network of research centers within its recently-announced Joint University Microelectronics Program (JUMP). SRC officially launched the 5-year, $200 million program on Jan. 1. With various research centers, the mission of JUMP is to lay the groundwork that extends the viability of Moore’s Law through 2040. The idea is... » read more

DARPA CHIPS Program Pushes For Chiplets
By Ann Mutschler - 14 Sep, 2017 - Comments: 0

While the semiconductor industry plugs away at More Than Moore innovation, the U.S. government is guiding its own SoC development. A new program kicked off last year called ‘Common Heterogeneous Integration and IP Reuse Strategies’ or CHIPS to take its own approach the incredibly high cost of SoC design and manufacturing. DARPA said it recognizes that the explosive growth in mobile and t... » read more

The Week In Review: IoT
By Jeff Dorsch - 08 Sep, 2017 - Comments: 0

Deals Deere & Co. has agreed to acquire Blue River Technology of Sunnyvale, Calif., for $305 million. The transaction is expected to close this month. Blue River develops computer vision and machine learning technology for use in precision agriculture. Monsanto Growth Ventures, Data Collective Venture Capital, Innovation Endeavors, Khosla Ventures, and Pontifax AgTech were among the investors... » read more

The Week In Review: Design
By Jesse Allen - 08 Sep, 2017 - Comments: 0

Tools Cadence unveiled an integrated memory design and verification tool, with environments for bitcell design, array and complier verification, and memory characterization. It utilizes existing simulation databases for multi-corner and Monte Carlo analysis, which the company says can lead to a 2X runtime improvement. Solido Design Automation uncorked PVTMC Verifier, which uses machine lear... » read more

RF GaN Gains Steam
By Mark LaPedus - 25 Jul, 2016 - Comments: 0

The RF [getkc id="217" kc_name="gallium nitride"] (GaN) device market is heating up amid the need for more performance with better power densities in a range of systems, such as infrastructure equipment, missile defense and radar. On one front, for example, RF GaN is beginning to displace a silicon-based technology for the power amplifier sockets in today’s wireless base stations. GaN is m... » read more

Manufacturing Bits: July 28
By Mark LaPedus - 28 Jul, 2015 - Comments: 0

Molecular chips Researchers from various organizations have devised a transistor consisting of a single molecule and a few atoms. The work could one day lead to the integration of molecular-based devices with existing semiconductor technologies. This work was conducted by Paul-Drude-Institut für Festkörperelektronik (PDI), Freie Universität Berlin (FUB), NTT and the U.S. Naval Research L... » read more

Manufacturing Bits: Dec. 23
By Mark LaPedus - 23 Dec, 2014 - Comments: 0

Higgs boson sensors At the recent 2014 IEEE International Electron Devices Meeting (IEDM) in San Francisco, CERN described the tiny hybrid pixel detectors used at the Large Hadron Collider (LHC). Using CMOS technology, hybrid pixel detectors identify and tag individual sub-atomic particles at fast speeds. CERN, the European Organization for Nuclear Research, is a particle physics laboratory... » read more

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