Chip Industry Week In Review


By Jesse Allen, Susan Rambo, and Liz Allan The U.S. government will invest about $3 billion for the National Advanced Packaging Manufacturing Program (NAPMP), including an advanced packaging piloting facility to help U.S. manufacturers adopt new technology and workforce training programs. It also will provide funding for projects concentrating on materials and substrates; equipment, tools, ... » read more

Chip Industry Week In Review


By Liz Allan, Jesse Allen, and Karen Heyman. Canon uncorked a nanoimprint lithography system, which the company said will be useful down to about the 5nm node. Unlike traditional lithography equipment, which projects a pattern onto a resist, nanoimprint directly transfers images onto substrates using a master stamp patterned by an e-beam system. The technology has a number of limitations and... » read more

Week In Review: Semiconductor Manufacturing, Test


The CHIPS for America team at the U.S. Department of Commerce named the selection committee who will select board members for the nonprofit entity that will likely be managing the National Semiconductor Technology Center (NSTC). Members include John Hennessy, chairman of Alphabet; Jason Matheny, president and CEO of the RAND Corporation; Don Rosenberg, fellow in residence at UCSD’s School of ... » read more

NIST Releases “Vision And Strategy for the National Semiconductor Technology Center”


A paper titled "A Vision and Strategy for the National Semiconductor Technology Center" was published by the U.S. Department of Commerce’s National Institute of Standards and Technology (NIST). The paper describes how the NSTC (National Semiconductor Technology Center) will develop and safeguard chips and technologies of the future. “The NSTC will be an ambitious public-private consortiu... » read more

Week In Review: Design, Low Power


The National Institute of Standards and Technology (NIST) outlined its plan for a National Semiconductor Technology Center (NSTC) to be created using a share of the $11 billion in funds from the CHIPS Act marked for research and development. While a large portion of the CHIPS Act investment is set to boost U.S. fabs and manufacturing capabilities, the NSTC aims to also support the design side, ... » read more

Week In Review: Design, Low Power


With funding from the Semiconductor Research Corporation, a group of 10 universities is banding together to create the Processing with Intelligent Storage and Memory center, or PRISM, led by University of California San Diego. The $50.5 million PRISM center will focus on four different themes: novel memory and storage devices and circuits; next generation architectures; systems and software; an... » read more

Week In Review: Semiconductor Manufacturing, Test


Micron selected Syracuse, New York as the site for its new megafab complex, which is expected to create 9,000 company jobs and 40,000 construction and supply chain jobs. President Biden called it “another win for America.” The chip manufacturing facility will be the nation’s largest, including a 7.2 million square foot complex and 2.4 million square foot of cleanroom. Site preparation wil... » read more