tag: NXP

Blog Review: Oct. 19
By Jesse Allen - 19 Oct, 2016 - Comments: 0

Mentor's Colin Walls provides some tips on writing portable, reusable code. Cadence's Christine Young contends that you should never use 2.5D for characterization at advanced nodes. Synopsys' Eric Huang considers one impractical use of USB heating and the IoT. Applied's Ben Lee predicts a rapid growth in China's power device manufacturing. NXP's Joppe Bos digs into the challenges of... » read more

Seeing The Future Of Vision
By Jeff Dorsch - 13 Oct, 2016 - Comments: 0

Vision systems have evolved from cameras that enable robots to “see” on a factory floor to a safety-critical element of the heterogeneous systems guiding autonomous vehicles, as well as other applications that call for parallel processing technology to quickly recognize objects, people, and the surrounding environment. Automotive electronics and mobile devices currently dominate embedded... » read more

Blog Review: Oct. 12
By Jesse Allen - 12 Oct, 2016 - Comments: 0

Mentor's Harry Foster digs into verification technology adoption trends for ASIC/IC. Cadence's Tom Anderson looks at the goals of the Portable Stimulus Working Group and how they compare to those of UVM. Synopsys' Eric Huang checks out what's new in the land of USB, Type-C adoption, and cable testing. Ansys' Aveek Sarkar explores the challenges facing 7nm designs and the benefits of ch... » read more

Blog Review: Oct. 5
By Jesse Allen - 05 Oct, 2016 - Comments: 0

Mentor's Michael White explores why established nodes are experiencing such an unexpectedly long lifespan and how that is driving new challenges for designers. Cadence's Ann Keffer checks out the history of Ethernet and how it won the battle to become the dominant network protocol. Is your IoT device fueling a botnet? Vulnerable firmware on internet connected devices was behind one of the... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 30 Sep, 2016 - Comments: 0

Chipmakers In 2016, growth in the pure-play foundry business will be driven by leading-edge processes, according to IC Insights. In fact, the increase in pure-play foundry sales this year is forecast to be almost entirely due to processes at » read more

Blog Review: Sept. 28
By Jesse Allen - 28 Sep, 2016 - Comments: 0

Cadence's Paul McLellan provides a glimpse of TSMC's roadmap, including what to look for at 7nm, low-power processes, and the ecosystem around the process. Mentor's Stephen Pateras notes that throughout the evolution of DFT, two rules for success have persisted. Early analysis suggests the largest DDoS attack in history, targeted at security reporter Brian Krebs, may have leveraged flaws ... » read more

Blog Review: Sept. 21
By Jesse Allen - 21 Sep, 2016 - Comments: 0

Mentor's Ricardo Anguiano takes a look at a proposal to prevent auto accidents from becoming pile-ups: the relaying of hazard information to the cloud and on to upcoming vehicles. Why get rid of 3.5mm audio jacks? Synopsys' Michael Posner says it's all about the power optimization in the upcoming USB Type-C digital audio specification. NXP's Anand Kannan also thinks Type-C should be the d... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 16 Sep, 2016 - Comments: 0

Chipmakers The finFET market is heating up. GlobalFoundries, Intel, Samsung and TSMC are ramping 16nm/14nm finFETs. And 10nm and 7nm finFETs are in the works. The market will shortly have a new competitor—Taiwan’s United Microelectronics Corp. (UMC). Some years ago, UMC licensed finFET technology from IBM. UMC has been a bit quiet about the 14nm finFET technology, but it has made si... » read more

Blog Review: Sept. 14
By Jesse Allen - 14 Sep, 2016 - Comments: 0

Are wide bandgap lll-V power devices feasible? Applied's Ben Lee considers the challenges, and potential rewards, of silicon carbide and gallium nitride. DVCon India chair Gaurav Jalan chats with keynote speaker Alok Jain about the challenges of verifying complex SoCs, the unique verification needs of the IoT, and what might lie beyond UVM. From power intent abstraction to automatic power... » read more

Cars, Security, and HW/SW Co-Design
By Jeff Dorsch - 13 Sep, 2016 - Comments: 0

Semiconductor Engineering sat down to discuss parallel hardware/software design with Johannes Stahl, director of product marketing, prototyping and FPGA, [getentity id="22035" e_name="Synopsys"]; [getperson id="11411" comment="Bill Neifert"], director of models technology, [getentity id="22186" comment="ARM"]; Hemant Kumar, director of ASIC design, Nvidia; and Scott Constable, senior member of ... » read more

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