Get Ready For Verification 3.0

By Brian Bailey - 24 May, 2018 - Comments: 0

Jim Hogan, managing partner of Vista Ventures, LLC, is perhaps the best-known investor in the EDA space. Recently, he has been focusing time and attention on verification startups, including cloud technology company Metrics, and Portable Stimulus pioneer Breker Verification Systems. This adds to his longer-term commitment to formal verification with OneSpin Solutions. These companies are part ... » read more

Tech Talk: Traceability In Functional Safety

By Ed Sperling - 24 May, 2018 - Comments: 0

Dominik Strasser, vice president of engineering at OneSpin Solutions, talks about the impact of functional safety regulations on liability and traceability in automotive, rail, industrial, nuclear and machinery applications. https://youtu.be/2jWnId8jQJg » read more

EDA In The Cloud (Part 3)

By Brian Bailey - 23 May, 2018 - Comments: 1

Semiconductor Engineering sat down to discuss the migration of EDA tools into the Cloud with Arvind Vel, director of product management at ANSYS; Michal Siwinski, vice president of product management at Cadence; Richard Paw, product marketing manager at DellEMC, Gordon Allan, product manager at Mentor, a Siemens Business; Doug Letcher, president and CEO of Metrics, Tom Anderson, technical marke... » read more

The Week In Review: Design

By Jesse Allen - 18 May, 2018 - Comments: 0

Tools & IP Synopsys uncorked ASIL B, C, and D ready versions of its DesignWare EV6x Embedded Vision Processors for automotive SoCs. An included Safety Enhancement Package provides hardware safety features, safety monitors, and lockstep capabilities for safety-critical designs. The processors integrate scalar, vector DSP, and CNN processing units for automotive systems that require deep lea... » read more

Toward Autonomous Farming

By Ann Mutschler - 03 May, 2018 - Comments: 0

While the automotive industry works diligently towards self-driving vehicles, it's possible the carrots you've eaten recently were semi-autonomously planted and harvested with Case IH equipment by Bolthouse Farms, one of the largest carrot growers in the United States. And the U.S. is hardly alone. Autonomous agriculture is coming everywhere, and it's happening much faster than autonomous ca... » read more

Finding And Fixing ML’s Flaws

By Ed Sperling - 02 May, 2018 - Comments: 0

OneSpin CEO Raik Brinkmann sat down with Semiconductor Engineering to discuss how to make machine learning more robust, predictable and consistent, and new ways to identify and fix problems that may crop up as these systems are deployed. What follows are excerpts of that conversation. SE: How do we make sure devices developed with machine learning behave as they're supposed to, and how do we... » read more

EDA In The Cloud (Part 2)

By Brian Bailey - 02 May, 2018 - Comments: 0

Why Your FPGA Synthesis Flow Requires Verification

By Tom Anderson - 26 Apr, 2018 - Comments: 0

When you think about it, logic synthesis is a vital but rather intimidating part of modern chip design. This process takes a high-level description of intended functionality, written in an RTL language that looks more like software than hardware, and implements it using the low-level building-block library of an ASIC or FPGA device. The resulting gate-level netlist must meet a variety of requir... » read more

Tech Talk: FPGA RTL Checking

By Ed Sperling - 26 Apr, 2018 - Comments: 3

Tobias Welp, software architect and engineering manager at OneSpin Solutions, explains how to ensure the RTL created by design engineers matches what shows up in an FPGA. https://youtu.be/0N1PDYyq0dY » read more

EDA In The Cloud

By Brian Bailey - 26 Apr, 2018 - Comments: 4

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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