tag: Onto Innovation

Week In Review: Manufacturing, Test
By Linda Christensen - 06 May, 2022 - Comments: 0

Acquisitions & Investments California-based MaxLinear plans to acquire Taiwan-based Silicon Motion (SMI), in a cash and stock deal valued at about $3.8 billion. Silicon Motion’s NAND flash controller technology for solid state storage devices, will extend MaxLinear’s RF, analog, and mixed signal portfolio. ISMC will invest about $3 billion in a semiconductor plant in India’s south... » read more

Nip The Defect In The Bud
By Melvin Lee - 12 Apr, 2022 - Comments: 0

As technology nodes shrink, end users are designing systems where each chip element is being targeted for a specific technology and manufacturing node. While designing chip functionality to address specific technology nodes optimizes a chip’s performance regarding that functionality, this performance comes at a cost: additional chips will need to be designed, developed, processed, and assembl... » read more

Week In Review: Manufacturing, Test
By Ed Sperling - 25 Mar, 2022 - Comments: 0

Worldwide fab equipment spending for front-end manufacturing is expected to hit $107 billion this year, an 18% year-over-year increase, according to SEMI’s latest World Fab Forecast report. “Crossing the $100 billion mark in spending on global fab equipment for the first time is a historic milestone for the semiconductor industry,” said Ajit Manocha, president and CEO of SEMI. Investme... » read more

Highly Selective Etch Rolls Out For Next-Gen Chips
By Mark LaPedus - 21 Mar, 2022 - Comments: 0

Several etch vendors are starting to ship next-generation selective etch tools, paving the way for new memory and logic devices. Applied Materials was the first vendor to ship a next-gen selective etch system, sometimes called highly-selective etch, in 2016. Now, Lam Research, TEL, and others are shipping tools with highly-selective etch capabilities, in preparation for futuristic devices su... » read more

Addressing The ABF Substrate Shortage With In-Line Monitoring
By Wesley Chou - 08 Mar, 2022 - Comments: 1

Ajinomoto build-up film (ABF) substrate has been a key component in chip manufacturing since its introduction shortly before the turn of the millennium. Substrates made with Ajinomoto build-up film – an electrical insulator designed for complex circuits – are found in PCs, routers, base stations, and servers. Looking ahead, the ABF substrate market will continue to grow, with revenue up ... » read more

Auto Chipmakers Dig Down To 10ppb
By Anne Meixner - 08 Mar, 2022 - Comments: 0

How do engineers deliver 10 defective parts per billion (Dppb) to auto makers if they only screen 1 million parts per year? Answer: By comprehending failure mechanisms and proactively screening for them. Modern automobiles contain nearly 1,000 ICs that must perform over the vehicle’s life (15 years). This drives quality expectations ever higher. While 10 Dppm used to be a solid benchmark, ... » read more

Weaving Digital Threads Into A Global Fabric Of Enterprise Knowledge
By Onto Innovation - 08 Mar, 2022 - Comments: 0

How smart manufacturing software provides visibility and control of all phases of the semiconductor manufacturing process. Run-to-run (R2R) automated process control gathers critical data from each production run and automatically adjusts process parameters for the next run based on sophisticated models of process performance. Click here to read more. » read more

Unknowns Driving Up The Cost Of Auto IC Reliability
By Ed Sperling - 08 Feb, 2022 - Comments: 2

Automotive chipmakers are considering a variety of options to improve the reliability of ICs used for everything from sensors to artificial intelligence. But collectively they could boost the number of process steps, increase the time spent in manufacturing and packaging, and stir up concerns about the amount of data that needs to be collected, shared, and stored. Accounting for advanced pro... » read more

Critical Moves: Advanced Logic Devices And CIS Benefit From Applications Using IRCD Metrology
By Nick Keller - 08 Feb, 2022 - Comments: 1

As 3D NAND continues to scale vertically — all in the name of increasing capacity and speed and reducing inefficiency and cost — maintaining channel hole critical dimension (CD) and shape uniformity becomes even more challenging. Faced with rising high-aspect ratios, addressing these challenges requires new inline non-destructive metrology to provide real-time process control. Infrared crit... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 21 Jan, 2022 - Comments: 0

Fabs Intel has announced plans for an initial investment of more than $20 billion in the construction of two new leading-edge fabs in Ohio. Planning for the first two factories will start immediately, with construction expected to begin late in 2022. Production is expected to come online in 2025. As part of the announcement, Air Products, Applied Materials, Lam Research and Ultra Clean Technol... » read more

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