tag: Onto Innovation

Preventing Failures Before They Occur
By Bryon Moyer - 11 Jan, 2022 - Comments: 1

A decade or so ago, when MEMS sensors were in the limelight, one of the touted applications was to install them on industrial or other equipment to get an advance warning if the equipment was approaching failure. Today, in-circuit monitoring brings the same promise. Are these competing technologies? Or can they be made to work together? “Almost all advanced tool manufacturing companies ... » read more

Extreme Ancestry: Silicon Edition
By Mike McIntyre - 11 Jan, 2022 - Comments: 0

The ability to trace the genealogy of all the components in an electronic device has been getting more complex for decades. For many industries — automotive, defense, medical and others — the need to locate the source of a problem in near real-time is paramount to gauging the extent of that problem. The extreme case is when the issue occurs with a product that already has been distributed a... » read more

Large-Field, Fine-Resolution Lithography Enables Next-Generation Panel-Level Packaging
By Onto Innovation - 11 Jan, 2022 - Comments: 0

The lithography challenge for large heterogeneous integration is the limited size of the exposure field (typically 60mm x 60mm or less) for most currently available lithography systems. Fine resolution and a large field size provide the user with the opportunity to increase the package size beyond 150mm x 150mm and maintain high throughput. This new capability has the potential to pave the ... » read more

GaN Application Base Widens, Adoption Grows
By Patrick Waurzyniak - 16 Dec, 2021 - Comments: 0

Gallium nitride (GaN) is beginning to show up across a broad range of power semiconductor applications due to its wide bandgap, enabling fast-charging, very high speeds, and much smaller form factors than silicon-based chips. Unlike silicon carbide (SiC), another wide-bandgap technology, GaN is a lateral rather than a vertical device. GaN tops out at about 900 volts, which limits its use in ... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 10 Dec, 2021 - Comments: 0

Semicon West news The Semicon West trade show opened this week with a hybrid in-person and virtual event. Several companies introduced new products or made announcements at Semicon. Some announcements coincided with the show. At Semicon, Lam Research introduced the Syndion GP, a new product that provides deep silicon etch capabilities to chipmakers developing next-generation power devices a... » read more

Using Manufacturing Data To Boost Reliability
By Ed Sperling and Ann Mutschler - 07 Dec, 2021 - Comments: 0

As chipmakers turn to increasingly customized and complex heterogeneous designs to boost performance per watt, they also are demanding lower defectivity and higher yields to help offset the rising design and manufacturing costs. Solving those issues is a mammoth multi-vendor effort. There can be hundreds of process steps in fabs and packaging houses. And as feature sizes continue to shrink, ... » read more

The 5G Rollout: Solving Advanced RF Metrology Challenges
By Johnny Dai - 07 Dec, 2021 - Comments: 0

The global radio frequency (RF) semiconductor market size is growing rapidly at a compound annual growth rate of 8.5%, with an expected increase from $17.4 billion in 2020 to $26.2 billion in 2025, according to Research and Markets [1]. As many are aware, the rollout of 5G technology and the Internet of Things (IoT), which is enabled by 5G, are the main driving forces for this growth. Growth... » read more

Big Payback For Combining Different Types Of Fab Data
By Anne Meixner - 07 Dec, 2021 - Comments: 1

Collecting and combining diverse data types from different manufacturing processes can play a significant role in improving semiconductor yield, quality, and reliability, but making that happen requires integrating deep domain expertise from various different process steps and sifting through huge volumes of data scattered across a global supply chain. The semiconductor manufacturing IC data... » read more

Extremely Large Exposure Field With Fine Resolution Lithography Technology To Enable Next Generation Panel Level Advanced Packaging
By Onto Innovation - 07 Dec, 2021 - Comments: 0

The growing demand for heterogeneous integration is driven by the 5G market that includes smartphones, data centers, servers, HPC, AI and IoT applications. Next-generation packaging technologies require tighter overlay to accommodate a larger package size with finer pitch chip interconnects on large format flexible panels. Heterogeneous integration enables next-generation device performance ... » read more

Enablers And Barriers For Connecting Diverse Data
By Anne Meixner - 09 Nov, 2021 - Comments: 0

More data is being collected at every step of the manufacturing process, raising the possibility of combining data in new ways to solve engineering problems. But this is far from simple, and combining results is not always possible. The semiconductor industry’s thirst for data has created oceans of it from the manufacturing process. In addition, semiconductor designs large and small now ha... » read more

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