tag: Onto Innovation

What Goes Wrong In Advanced Packages
By Ed Sperling - 24 Mar, 2021 - Comments: 1

Advanced packaging may be the best way forward for massive improvements in performance, lower power, and different form factors, but it adds a whole new set of issues that were much better understood when Moore's Law and the ITRS roadmap created a semi-standardized path forward for the chip industry. Different advanced packaging options — system-in-package, fan-outs, 2.5D, 3D-IC — have a... » read more

Chasing After Carbon Nanotube FETs
By Mark LaPedus - 18 Mar, 2021 - Comments: 6

Carbon nanotube transistors are finally making progress for potential use in advanced logic chips after nearly a quarter century in R&D. The question now is whether they will move out of the lab and into the fab. Several government agencies, companies, foundries, and universities over the years have been developing, and are now making advancements with carbon nanotube field-effect transi... » read more

Cloud Vs. On-Premise Analytics
By Anne Meixner - 09 Mar, 2021 - Comments: 2

The immense and growing volume of data generated in chip manufacturing is forcing chipmakers to rethink where to process and store that data. For fabs and OSATs, this decision is not one to be taken lightly. The proprietary nature of yield, performance, and other data, and corporate policies to retain tight control of that data, have so far limited outsourcing to the cloud. But as the amount... » read more

Controlling TC SAW Filter Frequency with Picosecond Ultrasonics
By Onto Innovation - 09 Mar, 2021 - Comments: 0

Presented during the poster session at ASMC 2019 PULSE™ technology is a first principles based acoustic metrology technique that is capable of measuring various parameters of interest in semiconductor manufacturing such as multi-layered metal thickness, sound velocity of dielectric films and reflectivity. In this paper, we demonstrate the applications of PULSE technology in the TC-SAW... » read more

Untangling 3D NAND: Tilt, Registration, And Misalignment
By Kevin Heidrich - 09 Mar, 2021 - Comments: 0

The multiple demands of 3D NAND to enable yield and performance increase in difficulty at each generation. First generation devices, at 24-32 layer pairs, pushed process tools to extremes, going quickly from 10:1 to 40:1 aspect ratios for today’s 64-96 pair single tier devices. The aspect ratios increased as fast as the manufacturing challenges. To continue bit density scaling, processing imp... » read more

Making Sure AI/ML Works In Test Systems
By Susan Rambo - 09 Mar, 2021 - Comments: 0

Artificial intelligence/machine learning is being utilized increasingly to find patterns and outlier data in chip manufacturing and test, improving the overall yield and reliability of end devices. But there are too many variables and unknowns to reliably predict how a chip will behave in the field using just AI. Today, every AI use case — whether a self-driving car or an industrial sortin... » read more

Part Average Tests For Auto ICs Not Good Enough
By Anne Meixner - 24 Feb, 2021 - Comments: 0

Part Average Testing (PAT) has long been used in automotive. For some semiconductor technologies it remains viable, while for others it is no longer good enough. Automakers are bracing for chips developed at advanced process nodes with much trepidation. Tight control of their supply chains and a reliance upon mature electronic processes so far have enabled them to increase electronic compone... » read more

Breaking The 2nm Barrier
By Mark LaPedus - 18 Feb, 2021 - Comments: 4

Chipmakers continue to make advancements with transistor technologies at the latest process nodes, but the interconnects within these structures are struggling to keep pace. The chip industry is working on several technologies to solve the interconnect bottleneck, but many of those solutions are still in R&D and may not appear for some time — possibly not until 2nm, which is expected t... » read more

Demystifying ADC
By Xuandong Cao - 09 Feb, 2021 - Comments: 1

ADC stands for automatic defect classification. It’s a software that classifies defects based on image and metadata such as location, ROI, and other information associated with a defect. ADC is not a mysterious black box that’s impossible to understand. Instead, ADC classifies defects the same way a human operator does, by first being trained by an expert. Then, just like human classificati... » read more

Data Issues Mount In Chip Manufacturing
By Anne Meixner - 09 Feb, 2021 - Comments: 2

For yield management systems the old calculation adage, "garbage in/garbage out" still rings true. Aligning and cleaning data remains a dirty business. With the increased value in data in the semiconductor supply chain, there now are essentially two supply chains running in parallel. One involves the physical product being created, while the other includes the data associated with each proce... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2025 SMG   |  Terms of Service  |  Privacy Policy