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Inverse lithography technology: 30 years from concept to practical, full-chip reality


Published in the Journal of Micro/Nanopatterning, Materials, and Metrology, Aug. 31, 2021. Read the full technical paper here (open access). Abstract In lithography, optical proximity and process bias/effects need to be corrected to achieve the best wafer print. Efforts to correct for these effects started with a simple bias, adding a hammer head in line-ends to prevent line-end shortening. T... » read more

Modeling Chips From Atoms To Systems


Complexity in hardware design is spilling over to other disciplines, including software, manufacturing, and new materials, creating issues for how to model more data at multiple abstraction levels. Challenges are growing around which abstraction level to use for a particular stage of the design, when to use it, and which data to include. Those decisions are becoming more difficult at each ne... » read more

The Quest For Curvilinear Photomasks


The semiconductor industry is making noticeable progress on the development of advanced curvilinear photomasks, a technology that has broad implications for chip designs at the most advanced nodes and the ability to manufacture those chips faster and cheaper. The question now is when will this technology move beyond its niche-oriented status and ramp up into high-volume manufacturing. For ye... » read more

AI And High-NA EUV At 3/2/1nm


Semiconductor Engineering sat down to discuss lithography and photomask issues with Bryan Kasprowicz, director of technology and strategy and a distinguished member of the technical staff at Photronics; Harry Levinson, principal at HJL Lithography; Noriaki Nakayamada, senior technologist at NuFlare; and Aki Fujimura, chief executive of D2S. What follows are excerpts of that conversation. To vie... » read more

Mask/Lithography Issues For Mature Nodes


Semiconductor Engineering sat down to discuss lithography and photomask issues with Bryan Kasprowicz, director of technology and strategy and a distinguished member of the technical staff at Photronics; Harry Levinson, principal at HJL Lithography; Noriaki Nakayamada, senior technologist at NuFlare; and Aki Fujimura, chief executive of D2S. What follows are excerpts of that conversation. ... » read more

How And Where ML Is Being Used In IC Manufacturing


Semiconductor Engineering sat down to discuss the issues and challenges with machine learning in semiconductor manufacturing with Kurt Ronse, director of the advanced lithography program at Imec; Yudong Hao, senior director of marketing at Onto Innovation; Romain Roux, data scientist at Mycronic; and Aki Fujimura, chief executive of D2S. What follows are excerpts of that conversation. Part one ... » read more

What Machine Learning Can Do In Fabs


Semiconductor Engineering sat down to discuss the issues and challenges with machine learning in semiconductor manufacturing with Kurt Ronse, director of the advanced lithography program at Imec; Yudong Hao, senior director of marketing at Onto Innovation; Romain Roux, data scientist at Mycronic; and Aki Fujimura, chief executive of D2S. What follows are excerpts of that conversation. L-R:... » read more

Mask Making Issues With EUV


Semiconductor Engineering sat down to discuss lithography and photomask trends with Bryan Kasprowicz, director of technology and strategy and a distinguished member of the technical staff at Photronics; Thomas Scheruebl, director of strategic business development and product strategy at Zeiss; Noriaki Nakayamada, senior technologist at NuFlare; and Aki Fujimura, chief executive of D2S. What fol... » read more

Curvilinear Full-Chip ILT


Leo Pang, chief product officer and executive vice president at D2S, talks about the speed improvements with full-chip inverse lithography technology, why it is so critical in stitching together large chips, and how this approach differs from traditional litho approaches. » read more

Process Window Optimization


David Fried, vice president of computational products at Lam Research, examines increasing process variation and interactions between various types of variation, why different approaches are necessary to improve yield and continue scaling. » read more

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