Is Verification At A Crossroads?

By Ann Mutschler - 27 Feb, 2014 - Comments: 1

As SoC verification methodologies and technologies have continued to mature, it’s an interesting time for engineering teams as they look to meet time to market goals and cut costs in an environment of cutthroat profit margins. Whether it is hardware emulation, FPGA prototyping, virtual prototyping or traditional software simulation, each platform has its strengths and drawbacks, with overl... » read more

The Uncertain Future Of Fabless Semis

By Ann Mutschler - 30 Jan, 2014 - Comments: 1

As with most things, perspective is everything, this is especially true when it comes to changes in the semiconductor ecosystem. Some industry watchers say indicators clearly point to a shift happening where system OEMs again make the decisions about what is in a chip, both software and hardware, pointing to Apple, Samsung, Microsoft and Intel as prime examples. As a result, the fabless semicon... » read more

Where Is 2.5D?

By Ed Sperling - 19 Dec, 2013 - Comments: 3

After nearly five years of concentrated research, development, test chips and characterization, 2.5D remains a possibility for many companies but a reality for very few. So what’s taking so long and why hasn’t all of this hype turned into production runs instead of test chips? Semiconductor Engineering spent the past two months interviewing dozens of people on this subject, from chipmakers ... » read more

Industry Restructures Around Cost

By Ed Sperling - 19 Dec, 2013 - Comments: 1

Talk to any semiconductor executive these days about what’s next for their company and you’ll probably encounter the same perspective—cost will drive future design decisions. Dig a little further, however, and you’ll find no consistent strategy for reducing that cost. While the industry has three very viable solutions for improving the power and performance characteristics of SoCs—... » read more

Experts At The Table: What’s Missing In The IoT

By Ed Sperling - 11 Dec, 2013 - Comments: 0

Semiconductor Engineering sat down to discuss the future of the IoT with Oleg Logvinov, director of market development for STMicroelectronics’ Industrial and Power Conversion Division; Martin Lund, senior vice president of the IP Group at Cadence; Naveed Sherwani, president and CEO of Open-Silicon; and Damon Hernandez, a member of the Web3D Consortium. What follows are excerpts of that conver... » read more

The Week In Review: Manufacturing & Design

By Mark LaPedus - 22 Nov, 2013 - Comments: 0

Intel is getting serious about the foundry business. “Intel CEO Brian Krzanich is making some waves. This is not because Intel is becoming more market driven, but that Intel will open its foundry to ‘any’ company able to utilize the company's leading-edge technology. It’s very refreshing to see Intel make this move and could have important implications for the industry. Based on Intel... » read more

Stacked Die Moves From Drawing Board To Reality

By Ed Sperling - 21 Nov, 2013 - Comments: 0

After decades of moving in a straight line from one process geometry shrink to the next, much of the semiconductor industry has taken a step back to figure out what comes next. While companies such as Intel, IBM and Samsung continue to look as far ahead as the 3nm process node, along with new materials to improve electron mobility and new transistor designs based on electron tunneling and carbo... » read more

Tech Talk: 2.5D Stacked Die

By Ed Sperling - 20 Nov, 2013 - Comments: 0

What's the motivation for moving to 2.5D packaging and architectures rather than following Moore's Law? Shafy Eltoukhy, VP of operations and technology development at Open-Silicon, talks with Semiconductor Engineering about adding another dimension in semiconductors. [youtube vid=HwpY9bUNt0w] » read more

Experts At The Table: What’s Missing In The IoT

By Ed Sperling - 15 Nov, 2013 - Comments: 0

Experts At The Table: What’s Missing In The IoT

By Ed Sperling - 07 Nov, 2013 - Comments: 0

← Older posts Newer posts →

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Open-Silicon

Is Verification At A Crossroads?

The Uncertain Future Of Fabless Semis

Where Is 2.5D?

Industry Restructures Around Cost

Experts At The Table: What’s Missing In The IoT

The Week In Review: Manufacturing & Design

Stacked Die Moves From Drawing Board To Reality

Tech Talk: 2.5D Stacked Die

Experts At The Table: What’s Missing In The IoT

Experts At The Table: What’s Missing In The IoT