tag: Optimal+

A More Efficient Way To Calculate Device Specs Of Thousands Of Tests For Improved Quality And Yield
By Guy Cortez - 05 Jun, 2017 - Comments: 0

Today’s devices are required to pass thousands of parametric tests prior to being shipped to customers. A key challenge test engineers face, in addition to optimizing the number of tests they run on the device, is how to quickly and accurately define the true specification limits that should be used to determine if the device is “good”. Device specification limits that are too wide may... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 19 May, 2017 - Comments: 0

Market research Intel retained its No. 1 position as the largest semiconductor manufacturer and grew its semiconductor revenue 4.6% in 2016, according to Gartner. Samsung Electronics continued to maintain the No. 2 spot with 11.7% market share. The largest mover in the top 25 was Broadcom, which moved up 12 places in the market share ranking, according to the firm. Worldwide silicon wafer a... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 12 May, 2017 - Comments: 0

Market research Intel held a slim 4% lead over Samsung for the number one position in terms of chip sales in the first quarter, according to IC Insights. But as reported, Samsung is on pace to displace Intel as the world’s largest semiconductor supplier in the second quarter, according to the firm. Meanwhile, in the ranking, SK Hynix and Micron made the biggest moves. And there was one new e... » read more

Finally, Realizing The Full Benefits Of Parallel Site-To-Site (S2S) Testing
By Guy Cortez - 08 May, 2017 - Comments: 0

A very common and well-known practice by manufacturers during the IC test process is to test as many of the device die or packaged parts as possible in parallel (i.e. sites) during wafer sort and final test in order to increase test time efficiency and lower overall test costs. The constraints that typically restrict how many test sites can be used at any given time are the design I/O and capac... » read more

IIoT Analytics
By Optimal Plus - 08 May, 2017 - Comments: 0

Founded in 1995, Marvell Technology Group Ltd. has operations worldwide and more than 7,000 employees. A leading fabless semiconductor company, Marvell ships over one billion chips a year. Marvell’s expertise in microprocessor architecture and digital signal processing, drives multiple platforms including high volume storage solutions, mobile and wireless, networking, consumer and green pr... » read more

IIoT Grows, But So Do Risks
By Jeff Dorsch - 04 May, 2017 - Comments: 1

By Jeff Dorsch & Ed Sperling After years of fitful progress, [getkc id="78" kc_name="Industrial Internet of Things"] technology is gaining adoption on the factory floor, in the electrical power grid, and other areas that could do with greater amounts of data analysis and insights from a connected ecosystem. AT&T, General Electric, IBM, Verizon Communications, and other large ... » read more

Is Product Quality Getting Lost In The IIoT?
By David Park - 10 Apr, 2017 - Comments: 0

Manufacturing operations have continuously evolved using data capture and management to assess and test production effectiveness on the manufacturing floor. The advent of the Industrial Internet of Things (IIoT) and its anticipated ability to track and manage the factory environment with machine-to-machine process analytics heralds yet another transformation, promising a higher level of data in... » read more

An Advanced Product Analytics Platform For Industry 4.0 And IIoT
By Optimal Plus - 10 Apr, 2017 - Comments: 0

Industry 4.0, Industrie 4.0 or the fourth industrial revolution, is the current trend of automation and data exchange in manufacturing technologies. IIoT is a critical component of Industry 4.0 combining sensing, intelligent analytics and Internet/cloud connectivity. One of the main tasks of Industry 4.0 is mass personalization (meeting the customer’s needs more effectively and efficiently) ... » read more

2.5D, FO-WLP Issues Come Into Focus
By Ann Mutschler - 10 Apr, 2017 - Comments: 2

Advanced packaging is beginning to take off after years of hype, spurred by 2.5D implementations in high-performance markets and fan-out wafer-level packaging for a wide array of applications. There are now more players viewing packaging as another frontier driving innovation. But perhaps a more telling sign is that large foundries in Taiwan have begun offering packaging services to customer... » read more

Quality Issues Widen
By Ed Sperling - 06 Mar, 2017 - Comments: 0

As the amount of semiconductor content in cars, medical and industrial applications increases, so does the concern about how long these devices will function properly—and what exactly that means. Quality is frequently a fuzzy concept. In mobile phones, problems have ranged from bad antenna placement, which resulted in batteries draining too quickly, to features that take too long to load. ... » read more

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