tag: ORNL

Chip Industry Week In Review
By The SE Staff - 15 Sep, 2023 - Comments: 0

By Gregory Haley, Jesse Allen, and Liz Allan TSMC told equipment vendors to delay deliveries of the most advanced tools due to uncertain demand, according to Reuters. The news drove down stock prices of all the major equipment providers. On the other hand, TSMC said advanced packaging shortages will constrain AI chip shipments for the next 18 months, according to NikkeiAsia. The United St... » read more

Week In Review: Auto, Security, Pervasive Computing
By Liz Allan - 25 Aug, 2023 - Comments: 0

The AI chip market is booming. Gartner expects revenue for the year will hit $53.4 billion, up 20.9% from 2022. The firm predicts that number will grow to $119 billion by 2027.  In the consumer electronics market, the value of AI-enabled application processors will amount to $1.2 billion in 2023, up from $558 million in 2022. Germany will spend nearly €1 billion (~US$1.7B) over the next t... » read more

Week In Review: Auto, Security, Pervasive Computing
By Liz Allan - 30 Jun, 2023 - Comments: 0

Inflection AI raised $1.3 billion in a new funding round led by Microsoft, Reid Hoffman, Bill Gates, Eric Schmidt, and NVIDIA after raising $225 million in the first round to support the ongoing development of Pi, a “useful, friendly, and fun” AI. In partnership with CoreWeave and NVIDIA, Inflection aims to build the world’s largest AI cluster, comprised of 22,000 NVIDIA H100 Tensor Core ... » read more

Week In Review: Auto, Security, Pervasive Computing
By Liz Allan - 09 Jun, 2023 - Comments: 0

Apple uncorked its spatial computer, the Vision Pro, and a new operating system, the visionOS. The “infinite screen real estate” basically untethers the screen from the box, allowing users to work in multiple windows with no space limits. While the device garnered mixed reviews, largely based upon its $3,500 price tag, the implications of mixed-reality computing are potentially significant ... » read more

Stabilizing A Hafnium Oxide-Based Thin Film When Sandwiched Between A Metal Substrate And An Electrode
By Technical Paper Link - 17 Nov, 2022 - Comments: 0

A technical paper titled "Origin of Ferroelectric Phase Stabilization via the Clamping Effect in Ferroelectric Hafnium Zirconium Oxide Thin Films" was published by researchers at University of Virginia, Brown University, Sandia National Labs, and Oak Ridge National Lab. Funding was given by U.S. DOE's 3D Ferroelectric Microelectronics Energy Frontier Research Center and the SRC. "This study ... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 23 Sep, 2022 - Comments: 0

Automotive, mobility Siemens Digital Industries Software and climate-tech company sustamize devised a way to add carbon emissions data to Siemens Xcelerator. Siemens created its Teamcenter Carbon Footprint Calculator software to help teams measure, simulate, reduce, and track their product carbon footprint early in the development phase. The calculator uses sustamize’s Product Footprint Engi... » read more

Week In Review: Auto, Security, Pervasive Computing
By Linda Christensen - 02 Sep, 2022 - Comments: 0

The great EV ramp EV-related developments are everywhere. California’s move to ban sales of new internal-combustion vehicles by 2035, and the U.S. government’s sweeping embrace of clean-energy, are in lockstep with recent moves by the auto industry and related supply chains, as well as cutting-edge research. One of the big breakthroughs is the ability to charge an EV in 10 minutes witho... » read more

Technical Paper Round-up: June 14
By Linda Christensen - 14 Jun, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=33 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a good fit f... » read more

ORNL: Advantages of Using Wide Bandgap Semiconductor Materials For Extreme Temp & Radiation
By Technical Paper Link - 13 Jun, 2022 - Comments: 0

Research paper from ORNL (Oak Ridge National Lab) titled "Wide Bandgap Semiconductors for Extreme Temperature and Radiation Environments." Abstract "With their greater voltage breakdowns, higher current limitations, and faster switching speeds, wide bandgap semiconductors are increasing in market application over the traditionally dominant silicon devices. Silicon carbide semiconductors hav... » read more

AlphaGo Game Influences Argonne’s New AI Tool For Materials Discovery
By Technical Paper Link - 10 Jun, 2022 - Comments: 0

Research paper titled "Learning in continuous action space for developing high dimensional potential energy models" from researchers at Argonne National Lab with contributions from Oak Ridge National Laboratory. Abstract "Reinforcement learning (RL) approaches that combine a tree search with deep learning have found remarkable success in searching exorbitantly large, albeit discrete action ... » read more

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