tag: Osaka University

Research Bits: Nov. 15
By Jesse Allen - 15 Nov, 2022 - Comments: 0

Low temperature 3D bonding Scientists from Osaka University developed a new method for the direct three-dimensional bonding of copper electrodes using silver layers. The method works at low temperatures and does not require external pressure. "Our process can be performed under gentle conditions, at relatively low temperatures and without added pressure, but the bonds were able to withstand... » read more

Week In Review: Manufacturing, Test
By Karen Heyman - 02 Sep, 2022 - Comments: 0

New fab construction At an event in Arizona, U.S. Commerce Secretary Gina Raimondo urged states to compete for funding made available for producing semiconductors by the U.S. federal government. Indeed, several companies are already doing just that. The latest developments include: Micron plans to invest approximately $15 billion through 2030 for a new memory fab near its existing headquart... » read more

Technical Paper Round-up: May 3
By Linda Christensen - 03 May, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=24 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a good fit for... » read more

Pyrolyzed Cellulose Nanofiber Paper (CNP) Semiconductor with a 3D Network Structure
By Technical Paper Link - 26 Apr, 2022 - Comments: 0

Abstract Semiconducting nanomaterials with 3D network structures exhibit various fascinating properties such as electrical conduction, high permeability, and large surface areas, which are beneficial for adsorption, separation, and sensing applications. However, research on these materials is substantially restricted by the limited trans-scalability of their structural design and tunability of... » read more

Power/Performance Bits: Dec. 21
By Jesse Allen - 21 Dec, 2021 - Comments: 0

Compact optical amplifier Researchers at Chalmers University of Technology propose a new optical amplifier design that is compact, high-performance, and doesn't generate excess noise. “We have developed the world's first optical amplifier that significantly enhances the range, sensitivity and performance of optical communication, that does not generate any excess noise – and is also com... » read more

Variational Quantum Algorithms (VQA)
By Technical Paper Link - 27 Aug, 2021 - Comments: 0

  Abstract "Applications such as simulating large quantum systems or solving large-scale linear algebra problems are immensely challenging for classical computers due their extremely high computational cost. Quantum computers promise to unlock these applications, although fault-tolerant quantum computers will likely not be available for several years. Currently available quantum device... » read more

Power/Performance Bits: June 22
By Jesse Allen - 22 Jun, 2021 - Comments: 0

Terahertz silicon multiplexer Researchers from Osaka University and University of Adelaide designed a silicon multiplexer for terahertz-range communications in the 300-GHz band. “In order to control the great spectral bandwidth of terahertz waves, a multiplexer, which is used to split and join signals, is critical for dividing the information into manageable chunks that can be more easily... » read more

Manufacturing Bits: May 25
By Mark LaPedus - 25 May, 2021 - Comments: 0

Higher voltage GaN Imec and Aixtron have demonstrated the ability to extend gallium-nitride (GaN) to new voltage levels in the power semiconductor market, enabling the technology to compete in much broader segments. Imec and Aixtron have demonstrated epitaxial growth of GaN buffer layers qualified for 1,200-volt applications on specialized 200mm substrates with a hard breakdown exceeding 1,... » read more

Power/Performance Bits: May 25
By Jesse Allen - 25 May, 2021 - Comments: 0

5G energy harvesting Researchers at Georgia Institute of Technology propose a way to harvest power for IoT devices using 5G networks. The team's device uses a flexible Rotman lens-based rectifying antenna (rectenna) system capable of millimeter-wave harvesting in the 28-GHz band. “With this innovation, we can have a large antenna, which works at higher frequencies and can receive power fr... » read more

Power/Performance Bits: May 18
By Jesse Allen - 18 May, 2021 - Comments: 0

Efficient high-voltage power conversion Researchers from École Polytechnique Fédérale de Lausanne (EPFL) and Enkris Semiconductor are working to design new power transistors with the aim of improving power converter efficiency. "We see examples of electric power losses every day, such as when the charger of your laptop heats up," said Elison Matioli, head of EPFL's POWERlab, noting that ... » read more

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