Week in Review: IoT, Security, Auto

By Jeff Dorsch - 24 Aug, 2018 - Comments: 0

Internet of Things Arm uncorked its first forward-looking CPU roadmap and performance numbers for client computing. The company said it expects to deliver annual performance improvements of more than 15% per year through 2020. The targeted market includes 5G, always-on, always-connected devices. C3 IoT will work with Google Cloud to support artificial intelligence and Internet of Things dep... » read more

System Bits: March 6

By Ann Mutschler - 06 Mar, 2018 - Comments: 0

Printed graphene biosensors According to researchers at the Fraunhofer Institute for Biomedical Engineering IBMT in St. Ingbert (in Germany’s Saarland region), cell-based biosensors can simulate the effect of various substances, such as drugs, on the human body in the laboratory but depending on the measuring principle, producing them can be expensive. As such, they aren’t used very often.... » read more

Systems Bits: Feb. 27

By Ann Mutschler - 27 Feb, 2018 - Comments: 0

Prepare to prevent malicious AI use According to the University of Cambridge, 26 experts on the security implications of emerging technologies have jointly authored a ground-breaking report thereby sounding the alarm about the potential malicious use of artificial intelligence (AI) by rogue states, criminals, and terrorists. The report forecasts rapid growth in cyber-crime and the misuse of... » read more

System Bits: Oct. 3

By Ann Mutschler - 03 Oct, 2017 - Comments: 0

Polariton graphs In a development that a team of researchers from the UK and Russia say could eventually surpass the capabilities of even the most powerful supercomputers, a type of ‘magic dust’ — which combines light and matter — can be used to solve complex problems. Hailing from the University of Cambridge, University of Southampton and Cardiff University in the UK and the Skolk... » read more

System Bits: Feb. 14

By Ann Mutschler - 14 Feb, 2017 - Comments: 0

Potential anticancer drugs selected by neural network Moscow Institute of Physics and Technology researchers along with Mail.Ru Group, and Insilico Medicine have applied a generative neural network to create new pharmaceutical medicines with certain desired characteristics. A generative adversarial network (GAN) was developed and trained to "invent" new molecular structures in order to dram... » read more

System Bits: Oct. 11

By Ed Sperling - 11 Oct, 2016 - Comments: 0

Carbon Is So 2015 Researchers at MIT have created a supercapacitor that relies on a material other than carbon. This new class of materials, called metal-organic frameworks (MOFs), are a porous and sponge-like, according to MIT, tthereby providing a much larger surface area than carbon. As with most things electrical, more surface area is essential for superconductors. The problem the re... » read more

Power/Performance Bits: May 17

By Jesse Allen - 17 May, 2016 - Comments: 0

Shrinking perovskites Researchers from Imperial College London, Oxford University, Diamond Light Source, Pohang University of Science and Technology in Korea, and Rutgers University have discovered a material that can be chemically tailored to either expand or contract in a precise way and over a wide temperature range. This could lead to new composite materials that do not expand when heate... » read more

Power/Performance Bits: Sept. 22

By Jesse Allen - 22 Sep, 2015 - Comments: 1

Photonic memories A team of researchers from Oxford University, the University of Münster, the Karlsruhe Institute of Technology, and the University of Exeter produced the first all-photonic nonvolatile memory chip. The new device uses the phase-change material Ge2Sb2Te5 (GST), used in rewritable CDs and DVDs, to store data. This material can be made to assume an amorphous state, like glass... » read more

Power/Performance Bits: July 21

By Jesse Allen - 21 Jul, 2015 - Comments: 0

Hybrid crystals for efficient LEDs A team from the University of Toronto combined two promising solar cell materials together for the first time, creating a new platform for LED technology. The team designed a way to embed strongly luminescent nanoparticles called colloidal quantum dots into perovskite. Perovskites are a family of materials that can be easily manufactured from solution, a... » read more

Power/Performance Bits: May 5

By Jesse Allen - 05 May, 2015 - Comments: 0

Single material batteries Engineers at the University of Maryland created a battery made entirely out of a single material that, by incorporating the properties of both the electrodes and electrolyte, can both move electricity and store it. The reason the new battery is revolutionary is because it solves the problem of what happens at the interface between the electrolyte and the electrod... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?