tag: PDF Solutions

Auto Chipmakers Dig Down To 10ppb
By Anne Meixner - 08 Mar, 2022 - Comments: 0

How do engineers deliver 10 defective parts per billion (Dppb) to auto makers if they only screen 1 million parts per year? Answer: By comprehending failure mechanisms and proactively screening for them. Modern automobiles contain nearly 1,000 ICs that must perform over the vehicle’s life (15 years). This drives quality expectations ever higher. While 10 Dppm used to be a solid benchmark, ... » read more

Advanced High Throughput e-Beam Inspection With DirectScan
By PDF Solutions - 08 Mar, 2022 - Comments: 0

Optical inspection cannot resolve critical defects at advanced nodes and cannot detect subsurface defects. Especially at 7nm and below, many yield and reliability killer defects are the result of interactions between lithography, etch, and fill. These defects often will have part per billion (PPB) level fail rates. Conventional eBeam tools lack the throughput to measure PPB level fail rates. A ... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 18 Feb, 2022 - Comments: 0

Automotive Renesas and AVL Software and Functions are collaborating to support developers of automotive ISO 26262-compliant electronic control units (ECUs). Renesas sells automotive R-Car SoCs, RH850 automotive control MCUs, PMICs, and software for levels ASIL B to ASIL D of ISO26262, but even with automotive ISO26262 parts, ECU system development process is never plug and play. Functional saf... » read more

Unknowns Driving Up The Cost Of Auto IC Reliability
By Ed Sperling - 08 Feb, 2022 - Comments: 2

Automotive chipmakers are considering a variety of options to improve the reliability of ICs used for everything from sensors to artificial intelligence. But collectively they could boost the number of process steps, increase the time spent in manufacturing and packaging, and stir up concerns about the amount of data that needs to be collected, shared, and stored. Accounting for advanced pro... » read more

Preventing Failures Before They Occur
By Bryon Moyer - 11 Jan, 2022 - Comments: 1

A decade or so ago, when MEMS sensors were in the limelight, one of the touted applications was to install them on industrial or other equipment to get an advance warning if the equipment was approaching failure. Today, in-circuit monitoring brings the same promise. Are these competing technologies? Or can they be made to work together? “Almost all advanced tool manufacturing companies ... » read more

Week In Review: Design, Low Power
By Jesse Allen - 10 Dec, 2021 - Comments: 0

Intel intends to take Mobileye public in mid-2022 on a US market through an IPO of newly issued stock. The subsidiary, which Intel acquired in 2017, develops SoCs for ADAS and autonomous driving solutions. Mobileye has achieved record revenue year-over-year with 2021 gains expected to be more than 40 percent higher than 2020, highlighting the powerful benefits to both companies of our ongoing p... » read more

Using Manufacturing Data To Boost Reliability
By Ed Sperling and Ann Mutschler - 07 Dec, 2021 - Comments: 0

As chipmakers turn to increasingly customized and complex heterogeneous designs to boost performance per watt, they also are demanding lower defectivity and higher yields to help offset the rising design and manufacturing costs. Solving those issues is a mammoth multi-vendor effort. There can be hundreds of process steps in fabs and packaging houses. And as feature sizes continue to shrink, ... » read more

Big Payback For Combining Different Types Of Fab Data
By Anne Meixner - 07 Dec, 2021 - Comments: 1

Collecting and combining diverse data types from different manufacturing processes can play a significant role in improving semiconductor yield, quality, and reliability, but making that happen requires integrating deep domain expertise from various different process steps and sifting through huge volumes of data scattered across a global supply chain. The semiconductor manufacturing IC data... » read more

Enablers And Barriers For Connecting Diverse Data
By Anne Meixner - 09 Nov, 2021 - Comments: 0

More data is being collected at every step of the manufacturing process, raising the possibility of combining data in new ways to solve engineering problems. But this is far from simple, and combining results is not always possible. The semiconductor industry’s thirst for data has created oceans of it from the manufacturing process. In addition, semiconductor designs large and small now ha... » read more

Coping With Parallel Test Site-to-Site Variation
By Anne Meixner - 09 Nov, 2021 - Comments: 1

Testing multiple devices in parallel using the same ATE results in reduced test time and lower costs, but it requires engineering finesse to make it so. Minimizing test measurement variation for each device under test (DUT) is a multi-physics problem, and it's one that is becoming more essential to resolve at each new process node and in multi-chip packages. It requires synchronization of el... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy