What Works Best For Chiplets


The semiconductor industry is preparing for the migration from proprietary chiplet-based systems to a more open chiplet ecosystem, in which chiplets fabricated by different companies of various technologies and device nodes can be integrated in a single package with acceptable yield. To make this work as expected, the chip industry will have to solve a variety of well-documented technical an... » read more

Fan-Out Panel-Level Packaging Hurdles


Fan-out panel-level packaging (FOPLP) promises to significantly lower assembly costs over fan-out wafer-level packaging, providing the relevant processes for die placement, molding and redistribution layers (RDLs) formation can be scaled up with equivalent yield. There is still much work to be done before that happens. Until now, FOPLP has been adopted for devices that are manufactured in ve... » read more

Many More Hurdles In Heterogeneous Integration


Advanced packaging options continue to stack up in the pursuit of “More than Moore” and higher levels of integration. It has become a place where many high-density interconnects converge, and where many new and familiar problems need to be addressed. The industry’s first foray into fine-pitch multi-die packaging utilized silicon interposers with through-silicon vias (TSVs) to deliver s... » read more

What Can Go Wrong In Heterogeneous Integration


Experts at the Table: Semiconductor Engineering sat down to discuss heterogeneous integration with Dick Otte, president and CEO of Promex Industries; Mike Kelly, vice president of chiplets/FCBGA integration at Amkor Technology; Shekhar Kapoor, senior director of product management at Synopsys; John Park, product management group director in Cadence's Custom IC & PCB Group; and Tony Mastroia... » read more

IP Tracking and Management


Semiconductor Engineering sat down to discuss IP tracking and management with Ranjit Adhikary, VP of marketing for ClioSoft; Jim Bruister, director digital systems (since retired) at Silvaco; Marc Greenberg, product marketing group director at Cadence; and Kelvin Low, VP of Marketing at Arm. What follows are excerpts from that conversation. SE: What is the scope of the problem? What are ... » read more

The Process Design Kit: Protecting Design Know-How


Once upon a time, integrated circuits (ICs) were built by the same companies that designed them. The design of an IC was tightly integrated with the manufacturing processes available within each company. In these days, when designs contained hundreds of transistors, companies modeled each feature in an IC at a first principles level, meaning each transistor or fundamental device was analyzed an... » read more

Enabling Automotive Design


Falling automotive electronics prices, propelled by advances in chip manufacturing and innovations on the design side, are driving a whole new level of demand across the automotive industry. Innovations that were introduced at the luxury end of the car market over the past couple years already are being implemented in more standard vehicles. The single biggest driver of change in the automo... » read more

The Future Of MEMS Design: Making MEMS Design More Like CMOS Design


MEMS-based component suppliers want to rapidly ramp their designs into high-volume production. This demand is driving MEMS suppliers to focus on ways to more efficiently re-use established process steps, stacks or technology platforms. To meet this need, we see the emergence of standard MEMS technology and design platforms similar to those used in CMOS design. The semiconductor industry and ... » read more

What To Do With A GaN PDK


Wolfspeed's Jeremy Fisher provides a hands on demo of how his group achieved a first-pass run of a 40GHz MMIC chip using using a PDK for its 0.14 micron process. [youtube vid=i7dsQG8CTO4] » read more

No More Easy IP Money


The semiconductor intellectual property ([getkc id="43" kc_name="IP"]) industry is two decades old, but questions are still being asked about what's wrong with it and what needs to be fixed. Normally these kinds of issues are reserved for fast-moving, young industries, not one that is the backbone of semiconductors. Design reuse has become an indispensable part of the design of nearly all el... » read more

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