Research Bits: Oct. 1


Rust-resistant coating for 2D semiconductors Researchers from Pennsylvania State University, National Yang Ming Chiao Tung University in Taiwan, Purdue University, Intel, and the Kurt J. Lesker Company developed a synthesis process to produce a rust-resistant coating with properties ideal for creating faster, more durable electronics. "One of the biggest issues that we see in 2D semiconduct... » read more

Chip Industry Technical Paper Roundup: July 30


New technical papers recently added to Semiconductor Engineering’s library, including a best paper award winner at ISCA. [table id=246 /] More ReadingTechnical Paper Library home » read more

Battery Electronification: Intracell Actuation And Thermal Management (Penn State, EC Power)


A technical paper titled “Battery electronification: intracell actuation and thermal management” was published by researchers at Pennsylvania State University and EC Power. Abstract: "Electrochemical batteries – essential to vehicle electrification and renewable energy storage – have ever-present reaction interfaces that require compromise among power, energy, lifetime, and safety. He... » read more

Research Bits: June 25


Quantum on silicon Researchers at the Harvard John A. Paulson School of Engineering and Applied Sciences (SEAS) developed a platform to probe and control qubits in silicon for quantum networks, after an earlier discovery that defects in silicon could be used to send and store quantum information over widely used telecommunications wavelengths. The device uses an electric diode to manipulate... » read more

Research Bits: May 28


Nanofluidic memristive neural networks Engineers from EPFL developed a functional nanofluidic memristive device that relies on ions, rather than electrons and holes, to compute and store data. “Memristors have already been used to build electronic neural networks, but our goal is to build a nanofluidic neural network that takes advantage of changes in ion concentrations, similar to living... » read more

Chip Industry Week In Review


Absolics, an affiliate of Korea materials company SKC, will receive up to $75 million in direct funding under the U.S. CHIPS Act for the construction of a 120,000 square-foot facility in Covington, Georgia, for glass substrates in advanced packaging. imec will host a €2.5 billion (~$2.72B) pilot line for researching chips beyond 2nm, partially funded through the EU Chips Act. imec CEO Luc ... » read more

Veterans Could Close The Semi Industry’s Workforce Gap


Veterans are beginning to form a valuable talent pool for advanced manufacturing and chip-sector positions, helping to fill the current and projected future gap in qualified workers as new fabs come online, and adding discipline and skills that are difficult to find otherwise. The job opportunities are many, and so are the possible job paths. In some cases, veterans are looking to make a qui... » read more

Chip Industry Technical Paper Roundup: April 30


These new technical papers were recently added to Semiconductor Engineering’s library. [table id=222 /] Find more technical papers here. » read more

Imaging of Coupled Film-Substrate Elastodynamics During an Insulator-to-Metal Transition (Penn State, et al.)


A new technical paper titled "In-Operando Spatiotemporal Imaging of Coupled Film-Substrate Elastodynamics During an Insulator-to-Metal Transition" was published by researchers at Pennsylvania State University, Cornell University, Argonne National Lab, Georgia Tech and Forschungsverbund Berlin. Abstract "The drive toward non-von Neumann device architectures has led to an intense focus on ins... » read more

Research Bits: April 16


Tunable thermal conductivity in memristors Researchers from the Center for Research in Biological Chemistry and Molecular Materials (CiQUS) and Forschungszentrum Juelich discovered that oxide-based memristive devices can demonstrate tunable thermal conductivity. Alongside the memristor's electrical resistive switching, a thermal resistive switching effect also occurs at the metal-oxide inte... » read more

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