Chip Industry Week In Review

By The SE Staff - 11 Apr, 2025 - Comments: 0

Don't have time to read this? Check out Semiconductor Engineering's Inside Chips podcast. The U.S. Department of Commerce is investigating TSMC for potential export control violations involving Huawei chips, reports Reuters. The probe follows TechInsights' teardown of a Huawei AI accelerator chip last year. The foundry, meanwhile, maintains it has not shipped any chips to Huawei since 2020... » read more

2D Materials Roadmap: Current And Future Challenges, Solutions

By Technical Paper Link - 08 Apr, 2025 - Comments: 0

A new technical paper titled "The 2D Materials Roadmap" was published by researchers at many institutions including Chinese Academy of Sciences, TU Denmark, Pennsylvania State University, University of Manchester, University of Cambridge et al. Abstract "Over the past two decades, 2D materials have rapidly evolved into a diverse and expanding family of material platforms. Many members of th... » read more

Chip Industry Week In Review

By The SE Staff - 13 Dec, 2024 - Comments: 0

The 2024 IEEE International Electron Devices Meeting (IEDM) was held this week, prompting a number of announcements from: imec: Proposed a new CFET-based standard cell architecture for the A7 node containing two rows of CFETs with a shared signal routing wall in between, allowing standard cell heights to be reduced from 4 to 3.5T, compared to single-row CFETs. Integrated indium pho... » read more

Research Bits: Oct. 1

By Liz Allan - 01 Oct, 2024 - Comments: 0

Rust-resistant coating for 2D semiconductors Researchers from Pennsylvania State University, National Yang Ming Chiao Tung University in Taiwan, Purdue University, Intel, and the Kurt J. Lesker Company developed a synthesis process to produce a rust-resistant coating with properties ideal for creating faster, more durable electronics. "One of the biggest issues that we see in 2D semiconduct... » read more

Chip Industry Technical Paper Roundup: July 30

By Linda Christensen - 30 Jul, 2024 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library, including a best paper award winner at ISCA. [table id=246 /] More ReadingTechnical Paper Library home » read more

Battery Electronification: Intracell Actuation And Thermal Management (Penn State, EC Power)

By Technical Paper Link - 27 Jul, 2024 - Comments: 0

A technical paper titled “Battery electronification: intracell actuation and thermal management” was published by researchers at Pennsylvania State University and EC Power. Abstract: "Electrochemical batteries – essential to vehicle electrification and renewable energy storage – have ever-present reaction interfaces that require compromise among power, energy, lifetime, and safety. He... » read more

Research Bits: June 25

By Liz Allan - 25 Jun, 2024 - Comments: 0

Quantum on silicon Researchers at the Harvard John A. Paulson School of Engineering and Applied Sciences (SEAS) developed a platform to probe and control qubits in silicon for quantum networks, after an earlier discovery that defects in silicon could be used to send and store quantum information over widely used telecommunications wavelengths. The device uses an electric diode to manipulate... » read more

Research Bits: May 28

By Jesse Allen - 28 May, 2024 - Comments: 0

Nanofluidic memristive neural networks Engineers from EPFL developed a functional nanofluidic memristive device that relies on ions, rather than electrons and holes, to compute and store data. “Memristors have already been used to build electronic neural networks, but our goal is to build a nanofluidic neural network that takes advantage of changes in ion concentrations, similar to living... » read more

Chip Industry Week In Review

By The SE Staff - 24 May, 2024 - Comments: 0

Absolics, an affiliate of Korea materials company SKC, will receive up to $75 million in direct funding under the U.S. CHIPS Act for the construction of a 120,000 square-foot facility in Covington, Georgia, for glass substrates in advanced packaging. imec will host a €2.5 billion (~$2.72B) pilot line for researching chips beyond 2nm, partially funded through the EU Chips Act. imec CEO Luc ... » read more

Veterans Could Close The Semi Industry’s Workforce Gap

By Liz Allan - 22 May, 2024 - Comments: 0

Veterans are beginning to form a valuable talent pool for advanced manufacturing and chip-sector positions, helping to fill the current and projected future gap in qualified workers as new fabs come online, and adding discipline and skills that are difficult to find otherwise. The job opportunities are many, and so are the possible job paths. In some cases, veterans are looking to make a qui... » read more

← Older posts

tag: Pennsylvania State University

Chip Industry Week In Review

2D Materials Roadmap: Current And Future Challenges, Solutions

Chip Industry Week In Review

Research Bits: Oct. 1

Chip Industry Technical Paper Roundup: July 30

Battery Electronification: Intracell Actuation And Thermal Management (Penn State, EC Power)

Research Bits: June 25

Research Bits: May 28

Chip Industry Week In Review

Veterans Could Close The Semi Industry’s Workforce Gap

Trending Articles

What Exactly Are Chiplets And Heterogeneous Integration?

Startup Funding: Q1 2025