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Hardware Encryption: Ultra-compact Active Interconnect Based on FeFET


New technical paper "Hardware functional obfuscation with ferroelectric active interconnects" from researchers at Penn State, Rochester Institute of Technology, GlobalFoundries Fab1, North Dakota State University. Abstract "Existing circuit camouflaging techniques to prevent reverse engineering increase circuit-complexity with significant area, energy, and delay penalty. In this paper, we... » read more

Academic Research Paper Round-Up: April 13


The volume of research into advanced semiconductors is rising and widening. The latest batch includes hybrid power-gating architecture, RRAM devices models, improved FMEA, quantum machine learning, enhanced nonlinear optics, harvesting energy after sundown, direct chemisorption-assisted nanotransfer printing, and more. Topping the list of researchers this week are ETH Zurich, Stanford Unive... » read more

Quantum Machine Learning: Security Threats & Lines Of Defense


New research paper from Pennsylvania State University explores quantum machine learning (QML) and its use in hardware security. Find the technical paper here. April 2022. Satwik Kundu and Swaroop Ghosh. 2022. Security Aspects of Quantum Machine Learning: Opportunities, Threats and Defenses (Invited). In Proceedings of the Great Lakes Symposium on VLSI 2022 (GLSVLSI ’22), June 6–8,... » read more

Microstructural impacts on ionic conductivity of oxide solid electrolytes from a combined atomistic-mesoscale approach


Academic paper from Lawrence Livermore National Laboratory (LLNL) scientists in collaboration with San Francisco State University and the The Pennsylvania State University. Abstract "Although multiple oxide-based solid electrolyte materials with intrinsically high ionic conductivities have emerged, practical processing and synthesis routes introduce grain boundaries and other interfaces t... » read more

Research Bits: March 29


Brain-like AI chip Researchers from Purdue University, Santa Clara University, Portland State University, Pennsylvania State University, Argonne National Laboratory, University of Illinois Chicago, Brookhaven National Laboratory, and University of Georgia built a reprogrammable chip that could be used as the basis for brain-like AI hardware. “The brains of living beings can continuously l... » read more

Power/Performance Bits: Jan. 25


Nanoscale 3D optics Researchers at Rice University and University of Houston are using 3D printing to build nanostructures of silica for micro-scale electronic, mechanical, and photonic devices. “It’s very tough to make complicated, three-dimensional geometries with traditional photolithography techniques,” said Jun Lou, a professor of materials science and nanoengineering at Rice. ... » read more

Manufacturing Bits: Dec. 6


China’s rare earth power play Rare earth elements (REEs) are back in the news. China, the world’s largest supplier of rare earths, plans to combine three domestic vendors to create a large state-owned company with a nearly 70% share of the REE market, according to reports from Nikkei and others. In 2020, China in total accounted for 85% of global production of refined REEs, accordi... » read more

Power/Performance Bits: Nov. 16


Light-emitting memory Researchers from Kyushu University and National Taiwan Normal University propose a 'light-emitting memory' based on a perovskite that can simultaneously store and visually transmit data. The team used the idea in conjunction with resistive RAM (RRAM), in which states of high and low resistance represent ones and zeros. "The electrical measurements needed to check the r... » read more

Power/Performance Bits: Oct. 26


Printing circuits on irregular shapes Researchers at Pennsylvania State University propose a way to print biodegradable circuits on irregular, complex shapes. “We are trying to enable direct fabrication of circuits on freeform, 3-D geometries,” said Huanyu “Larry” Cheng, professor in Penn State's Department of Engineering Science and Mechanics (ESM). “Printing on complicated objec... » read more

A quantitative model for the bipolar amplification effect: A new method to determine semiconductor/oxide interface state densities


Abstract "We report on a model for the bipolar amplification effect (BAE), which enables defect density measurements utilizing BAE in metal–oxide–semiconductor field-effect transistors. BAE is an electrically detected magnetic resonance (EDMR) technique, which has recently been utilized for defect identification because of the improved EDMR sensitivity and selectivity to interface defects.... » read more

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