Chip Industry Technical Paper Roundup: April 30


These new technical papers were recently added to Semiconductor Engineering’s library. [table id=222 /] Find more technical papers here. » read more

Imaging of Coupled Film-Substrate Elastodynamics During an Insulator-to-Metal Transition (Penn State, et al.)


A new technical paper titled "In-Operando Spatiotemporal Imaging of Coupled Film-Substrate Elastodynamics During an Insulator-to-Metal Transition" was published by researchers at Pennsylvania State University, Cornell University, Argonne National Lab, Georgia Tech and Forschungsverbund Berlin. Abstract "The drive toward non-von Neumann device architectures has led to an intense focus on ins... » read more

Research Bits: April 16


Tunable thermal conductivity in memristors Researchers from the Center for Research in Biological Chemistry and Molecular Materials (CiQUS) and Forschungszentrum Juelich discovered that oxide-based memristive devices can demonstrate tunable thermal conductivity. Alongside the memristor's electrical resistive switching, a thermal resistive switching effect also occurs at the metal-oxide inte... » read more

Research Bits: Feb. 27


Phonon-magnon reservoir Researchers from TU Dortmund, Loughborough University, V. E. Lashkaryov Institute of Semiconductor Physics, and University of Nottingham were inspired by the human eye to propose an on-chip phonon-magnon reservoir for neuromorphic computing. In reservoir computing, input signals are mapped into a multidimensional space, which is not trained and only expedites recogni... » read more

Chip Industry Technical Paper Roundup: Jan 2


New technical papers added to Semiconductor Engineering’s library this week. [table id=180 /] More ReadingTechnical Paper Library home » read more

FeFET Memory Encrypted Inside The Storage Array


A new technical paper titled "Embedding security into ferroelectric FET array via in situ memory operation" was published by researchers at Pennsylvania State University, University of Notre Dame, Fraunhofer IPMS, National University of Singapore, and North Dakota State University. Abstract "Non-volatile memories (NVMs) have the potential to reshape next-generation memory systems because of... » read more

Chip Industry’s Technical Paper Roundup: Dec 11


New technical papers added to Semiconductor Engineering’s library this week. [table id=174 /] More ReadingTechnical Paper Library home » read more

Tapping 2D van der Waals Ferroelectrics For Use In Next-Generation Electronics


A technical paper titled “Domain-dependent strain and stacking in two-dimensional van der Waals ferroelectrics” was published by researchers at Rice University, Massachusetts Institute of Technology, University of Texas at Arlington, Texas A&M University, and Pennsylvania State University. Abstract: "Van der Waals (vdW) ferroelectrics have attracted significant attention for their pot... » read more

Research Bits: Aug. 7


Stretchy semiconductors Researchers from Pennsylvania State University, University of Houston, Southeast University, and Northwestern University are working towards fully flexible electronics. “Such technology requires stretchy elastic semiconductors, the core material needed to enable integrated circuits that are critical to the technology enabling our computers, phones and so much more,... » read more

Week In Review: Design, Low Power


Cadence will acquire Rambus' SerDes and memory interface PHY IP business. Rambus will retain its digital IP business, including memory and interface controllers and security IP. “With this transaction, we will increase our focus on market-leading digital IP and chips and expand our roadmap of novel memory solutions to support the continued evolution of the data center and AI,” said Sean Fan... » read more

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