Covid-19 Tech Bits: April 14


Modeling coronavirus spread Four teams of Finnish researchers have modeled the coughing spread of COVID-19 in tight indoor areas, such as grocery stores and public transportation systems, using a supercomputer and 3D visualization. “The aerosol cloud spreads outside the immediate vicinity of the coughing person and dilutes in the process," said Aalto University Assistant Professor Ville V... » read more

Week In Review: Design, Low Power


Ansys will acquire Lumerical, a developer of photonic design and simulation tools. "The potential of photonics in applications like 5G, IIoT and autonomous vehicles can only be realized by solving immense multiphysics device and system challenges," said James Pond, co-CEO and CTO of Lumerical. "Together, Lumerical and Ansys are uniquely positioned to provide the necessary solutions, and custome... » read more

Startup Funding: January 2020


A dozen tech startup companies started 2020 with new funding, raising +$500 million between them. Three companies received an impressive amount of investment. Stanford spinout Skylo launched from stealth with $116M in total funding and a bold plan to connect IoT devices, particularly sensors in remote or difficult-to-access environments, with hubs that link them to a network of satellites. ... » read more

Power/Performance Bits: Oct. 29


Chip scanning Researchers at the University of Southern California and the Paul Scherer Institut in Switzerland developed an x-ray technique to non-destructively scan chips to make sure they conform to specifications. Such a system could be used to identify manufacturing defects or malicious alterations, the team said. Called ptychographic x-ray laminography, the technique utilizes x-rays f... » read more

Power/Performance Bits: Oct. 22


Flexible battery Researchers at ETH Zurich developed a flexible thin-film battery that can be bent, stretched, and twisted without interrupting the supply of power. Key to the battery is a new electrolyte and entirely flexible components. "To date, no one has employed exclusively flexible components as systematically as we have in creating a lithium-ion battery," said Markus Niederberger, P... » read more

Power/Performance Bits: Oct. 9


Topological insulator waveguides Engineers at the University of Pennsylvania and Polytechnic University of Milan applied topological insulators to photonic chips to make reconfigurable waveguides. In topological insulators, charged particles can flow freely on the material's edges but can't pass through the interior. For photonics, topological insulators with edges that could be redefined m... » read more

Implementing A Multi-Domain System


IoT systems are multi-domain designs that often require AMS, Digital, RF, photonics and MEMS elements within the system. Tanner EDA provides an integrated, top-down design flow for IoT design that supports all these design domains. Learn more about key solutions that the Tanner design flow offers for successful IoT system design and verification. To read more, click here. » read more

System Bits: Oct. 1


Jumping the gap in microchips A quasi-particle that travels along the interface of a metal and dielectric material may be the solution to problems caused by shrinking electronic components, according to an international team of engineers. "Microelectronic chips are ubiquitous today," said Akhlesh Lakhtakia, Evan Pugh University Professor and Charles Godfrey Binder Professor of Engineering S... » read more

System Bits: July 10


Light waves run on silicon-based chips Researchers at the University of Sydney’s Nano Institute and Singapore University of Technology and Design collaborated on manipulating light waves on silicon-based microchips to keep coherent data as it travels thousands of miles on fiber-optic cables. Such waves—whether a tsunami or a photonic packet of information—are known as solitons. The... » read more

Manufacturing Bits: June 25


Panel-level consortium Fraunhofer is moving forward with the next phase of its consortium to develop technologies for panel-level packaging. In 2016, Fraunhofer launched the original effort, dubbed the Panel Level Packaging Consortium. The consortium, which had 17 partners, developed various equipment and materials in the arena. Several test layouts were designed for process development on ... » read more

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