Two Chip-Scale Photonic Systems For Optical Data Transmission & Microwave Photonics


New research paper "Microcomb-driven silicon photonic systems" from Peking University, UCSB, and Peng Cheng Laboratory. Abstract "Microcombs have sparked a surge of applications over the past decade, ranging from optical communications to metrology. Despite their diverse deployment, most microcomb-based systems rely on a large amount of bulky elements and equipment to fulfil their desir... » read more

How To Create A Physics-Based Laser Compact Model For A Photonic Process Design Kit (PDK)


This paper discusses the importance of accurate laser compact models in photonic process design kits, describes different laser models available in Ansys Lumerical INTERCONNECT, and explains optimal steps to create a laser compact model that includes temperature and noise effects. Click here to access the paper. » read more

Neuromorphic photonic circuit modeling in Verilog-A


Abstract "One of the significant challenges in neuromorphic photonic architectures is the lack of good tools to simulate large-scale photonic integrated circuits. It is crucial to perform simulations on a single platform to capture the circuit’s behavior in the presence of both optical and electrical components. Here, we adopted a Verilog-A based approach to model neuromorphic photonic cir... » read more

Experimental photonic quantum memristor


Abstract "Memristive devices are a class of physical systems with history-dependent dynamics characterized by signature hysteresis loops in their input–output relations. In the past few decades, memristive devices have attracted enormous interest in electronics. This is because memristive dynamics is very pervasive in nanoscale devices, and has potentially groundbreaking applications ranging... » read more

Wavelength Multiplexed Ultralow-Power Photonic Edge Computing


Abstract "Advances in deep neural networks (DNNs) are transforming science and technology. However, the increasing computational demands of the most powerful DNNs limit deployment on low-power devices, such as smartphones and sensors -- and this trend is accelerated by the simultaneous move towards Internet-of-Things (IoT) devices. Numerous efforts are underway to lower power consumption, but ... » read more

Large-area photonic lift-off process for flexible thin-film transistors


Abstract "Fabricating flexible electronics on plastic is often limited by the poor dimensional stability of polymer substrates. To mitigate, glass carriers are used during fabrication, but removing the plastic substrate from a carrier without damaging the electronics remains challenging. Here we utilize a large-area, high-throughput photonic lift-off (PLO) process to rapidly separate polymer f... » read more

Research Bits: March 15


Interferometer on chip Researchers at the University of Rochester developed an optical interferometer on a 2mm by 2mm integrated photonic chip that is capable of amplifying interferometric signals without a corresponding increase in extraneous noise. Interferometers merge two or more sources of light to create interference patterns that provide information able what they illuminate. “If y... » read more

Power/Performance Bits: Feb. 7


Stopping interference in integrated photonics Researchers at EPFL and Purdue University combined integrated photonics and MEMS to develop an electrically driven optical isolator-on-a-chip that transmits light in only one direction. Optical isolators are useful to prevent reflected light from other components compromising or interfering with an on-chip laser’s performance. They are often c... » read more

Electro-optic spatial light modulator from an engineered organic layer


Abstract "Tailored nanostructures provide at-will control over the properties of light, with applications in imaging and spectroscopy. Active photonics can further open new avenues in remote monitoring, virtual or augmented reality and time-resolved sensing. Nanomaterials with χ(2) nonlinearities achieve highest switching speeds. Current demonstrations typically require a trade-off: they eith... » read more

Expanding Advanced Packaging Production In The U.S.


The United States is taking the first steps toward bringing larger-scale IC packaging production capabilities back to the U.S. as supply chain concerns and trade tensions grow. The U.S. is among the leaders in developing packages, especially new and advanced forms of the technology that promise to shake up the semiconductor landscape. And while the U.S. has several packaging vendors, North A... » read more

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