tag: photoresists

Benefits And Limits Of Using ML For Materials Discovery
By Katherine Derbyshire - 18 Dec, 2025 - Comments: 0

Machine learning tools can accelerate all stages of materials discovery, from initial screening to process development. Whether the goal is to identify new applications for known materials or to design new molecules for a particular task, these tools help materials scientists find correlations in large data libraries. Still, machine learning tools are not magic. “Software tools are only as... » read more

Systematic Lithographic Patterning Characterization Of An Al-based Hybrid Resist (Stonybrook, UT Dallas, Brookhaven)
By Technical Paper Link - 10 Dec, 2025 - Comments: 0

A new technical paper titled "Molecular Layer Deposited Aluminum-Based Hybrid Resist for High-Resolution Nanolithography and Direct Ultra-High Aspect Ratio Pattern Transfer" was published by researchers at Stony Brook University, the University of Texas at Dallas, and Brookhaven National Laboratory. Excerpt "Here, this study reports the systematic lithographic patterning characterization ... » read more

First Stage Of Nanoscale Imaging In Positive-Tone EUV Photoresists: The Impact Of Polymer Sequence (Berkeley Lab, Columbia Hill)
By Technical Paper Link - 06 Oct, 2025 - Comments: 0

A new technical paper titled "Initial stage of nanoscale imaging in positive-tone extreme UV photoresists: the influence of polymer sequence" was published by researchers at Lawrence Berkeley National Laboratory and Columbia Hill Technical Consulting. Abstract "Photolithographic patterning using extreme ultraviolet (EUV, 92.5 eV) light is a radiolytic process that initially forms electrons,... » read more

Research Bits: Sept. 16
By Jesse Allen - 16 Sep, 2025 - Comments: 0

Beyond-EUV resists Researchers from Johns Hopkins University, East China University of Science and Technology, École Polytechnique Fédérale de Lausanne (EPFL), Soochow University, Brookhaven National Laboratory, and Lawrence Berkeley National Laboratory propose a combination of new resist materials and a higher-powered EUV process that could enable smaller chip feature sizes. The "beyond... » read more

Viability of aZnMIm As A Resist For EUV Lithography (Johns Hopkins, Northwestern, Intel et al.)
By Technical Paper Link - 27 Jun, 2025 - Comments: 0

A new technical paper (preprint) titled "Extreme Ultraviolet and Beyond Extreme Ultraviolet Lithography using Amorphous Zeolitic Imidazolate Resists Deposited by Atomic/Molecular Layer Deposition" was published by researchers at Johns Hopkins University, Northwestern University, Intel Corporation, Bruker Nano, EUV Tech and Lawrence Berkeley National Lab. The paper states "This study demonstr... » read more

Mask Complexity, Cost, And Change
By Gregory Haley - 22 May, 2025 - Comments: 0

Experts at the Table: As leading-edge lithography nodes push further into EUV and beyond, mask-making has become one of the most critical and costly aspects of semiconductor manufacturing. At the same time, non-EUV applications are stretching the lifetime of older tools and processes, challenging the industry to find new solutions for both ends of the spectrum. Semiconductor Engineering sat dow... » read more

Many Options For EUV Photoresists, No Clear Winner
By Katherine Derbyshire - 20 Mar, 2025 - Comments: 4

In EUV lithography, and especially high-numerical-aperture EUV, balancing tradeoffs between resolution, sensitivity and line-width roughness is becoming increasingly difficult. Lithography patterning using extreme UV exposure depends on a resist mask that can simultaneously meet targets of small feature resolution, high sensitivity to EUV wavelength, and acceptable linewidth roughness. Unfor... » read more

Innovations Driving The Advanced Packaging Roadmap: Part One
By Keith Best - 14 Jan, 2025 - Comments: 1

Advanced IC substrates (AICS) have been marching toward the 2µm line/space (L/S) redistribution layer (RDL) technology node for some time (figure 1). However, many questions remain about the ability of organic substrates to meet the line/space requirements of the next generation of advanced packages (AP), those below 2µm L/S and perhaps to 1.5µm L/S. Simply put: are organic substrates up to ... » read more

Recent Progress in Inorganic Metal-Oxide-Based Photoresists For EUVL
By Technical Paper Link - 29 Oct, 2024 - Comments: 0

A technical paper titled "Recent Advances in Metal-Oxide-Based Photoresists for EUV Lithography" was published by researchers at University of South–Eastern Norway. Abstract: "Extreme ultraviolet lithography (EUVL) is a leading technology in semiconductor manufacturing, enabling the creation of high-resolution patterns essential for advanced microelectronics. This review highlights recent... » read more

Photoresist Materials Development
By Toru Fujimori - 20 Jun, 2024 - Comments: 0

Toru Fujimori of FUJIFILM Corporation provides an overview of the development of photoresist materials for masks and wafers to support continued pattern shrinkage and address stochastic issues in lithography. » read more

← Older posts

  • Sponsors

  • Standards/Organizations

About

Navigation

Connect With Us

Copyright ©2013-2026 SMG   |  Terms of Service  |  Privacy Policy