tag: photoresists

EUV Challenges And Unknowns At 3nm and Below
By Mark LaPedus - 19 Nov, 2020 - Comments: 1

The chip industry is preparing for the next phase of extreme ultraviolet (EUV) lithography at 3nm and beyond, but the challenges and unknowns continue to pile up. In R&D, vendors are working on an assortment of new EUV technologies, such as scanners, resists, and masks. These will be necessary to reach future process nodes, but they are more complex and expensive than the current EUV pro... » read more

Multi-Patterning EUV Vs. High-NA EUV
By Mark LaPedus - 04 Dec, 2019 - Comments: 4

Foundries are finally in production with EUV lithography at 7nm, but chip customers must now decide whether to implement their next designs using EUV-based multiple patterning at 5nm/3nm or wait for a new single-patterning EUV system at 3nm and beyond. This scenario revolves around ASML’s current extreme ultraviolet (EUV) lithography tool (NXE:3400C) versus a completely new EUV system with... » read more

Outlook For Masks, Materials and Wafers
By Mark LaPedus - 15 Aug, 2019 - Comments: 0

After a slowdown in the first half of 2019, chipmakers and equipment vendors face a cloudy outlook for the second half of this year, with a possible recovery in 2020. But what about other key technologies like materials, photomasks and silicon wafers? These are also critical for the semiconductor supply chain and are key indicators where the market is heading. In the first half of 2019, m... » read more

Finding The Source Of EUV Stochastic Effects
By Katherine Derbyshire - 15 Apr, 2019 - Comments: 7

The next phase of EUV development has begun—making EUV more predictable and potentially more mainstream—and it's looking to be every bit as difficult and ambitious as other developments in advanced lithography. In the early days of EUV development, supporters of the technology argued that it was “still based on photons,” as opposed to alternatives like electron beam lithography. Whil... » read more

Planarization Challenges At 7nm And Beyond
By Ed Sperling - 10 Dec, 2018 - Comments: 0

Dan Sullivan, executive director of semiconductor technology at Brewer Science, digs into the challenges of planarizing a thin film on a wafer for etch and optical control. The problem becomes more difficult at advanced nodes because the films are thinner. https://youtu.be/iNA6EGpoYZU     _________________________________ See more tech talk videos here   » read more

Inside Lithography And Masks
By Mark LaPedus - 05 Apr, 2017 - Comments: 3

Semiconductor Engineering sat down to discuss lithography and photomask technologies with Gregory McIntyre, director of the Advanced Patterning Department at [getentity id="22217" e_name="Imec"]; Harry Levinson, senior fellow and senior director of technology research at [getentity id="22819" comment="GlobalFoundries"]; David Fried, chief technology officer at [getentity id="22210" e_name="Cove... » read more

7nm Fab Challenges
By Mark LaPedus - 21 Apr, 2016 - Comments: 3

Leading-edge foundry vendors have made the challenging transition from traditional planar processes into the finFET transistor era. The first [getkc id="185" kc_name="finFETs"] were based on the 22nm node, and now the industry is ramping up 16nm/14nm technologies. Going forward, the question is how far the finFET can be scaled. In fact, 10nm finFETs from Samsung are expected to ramp by ye... » read more

Where Is Next-Gen Lithography?
By Mark LaPedus - 31 Mar, 2016 - Comments: 2

Semiconductor Engineering sat down to discuss lithography and photomask technologies with Greg McIntyre, director of the Advanced Patterning Department at [getentity id="22217" comment="Imec"]; Harry Levinson, senior fellow and senior director of technology research at [getentity id="22819" comment="GlobalFoundries"]; Uday Mitra, vice president and head of strategy and marketing for the Etch Bu... » read more

Where Is Next-Gen Lithography?
By Mark LaPedus - 17 Mar, 2016 - Comments: 4

Semiconductor Engineering sat down to discuss lithography and photomask technologies with Greg McIntyre, director of the Advanced Patterning Department at [getentity id="22217" comment="Imec"]; Harry Levinson, senior fellow and senior director of technology research at [getentity id="22819" comment="GlobalFoundries"]; Uday Mitra, vice president and head of strategy and marketing for the Etch Bu... » read more

Photoresist Problems Ahead
By Ann Mutschler - 14 Nov, 2014 - Comments: 2

As the semiconductor industry begins its ramp to manufacturing at 10nm and below, activity is heating up involving lithography modeling. The goal is to be ready when all the pieces of the puzzle are in place. That includes [gettech id="31045" comment="EUV"], when it finally becomes commercially viable, as well as extending ArF [getkc id="80" comment="lithography"]. When it comes to lithogra... » read more

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