The Week In Review: Manufacturing


SEMI released its book-to-bill report for the North American semiconductor industry. The ratio was 1.02 for the month of July, up from 0.98 in June and 0.99 in May. The ratio is a three-month moving average of bookings and billings, and for July the average hit $1.559 billion. That's the highest so far this year, and it's up 12.5% year over year. Brooks Automation acquired Contact Co.,... » read more

The Week In Review: Manufacturing


Intel is in talks to buy Altera, according to The Wall Street Journal. If a deal is reached, Intel would enter the FPGA market amid a slowdown in its core processors business. Intel would also secure its largest foundry customer in Altera. For years, Altera’s sole foundry was TSMC. Then, not long ago, Altera selected Intel as its foundry partner for 14nm. TSMC still handles 20nm and above wor... » read more

The Week In Review: Manufacturing


At the SPIE Advanced Lithography conference in San Jose, Calif., there were several takeaways. First, the battle for lithography share is heating up at Intel. “We believe Nikon still holds a decent position at Intel, but with ASML gaining some share at 10nm. Nikon could regain some share with its new platform at 7nm, in our view, but it is early to tell. We believe Nikon has improved its posi... » read more

The Week In Review: Manufacturing


For years, chipmakers have attempted to build fabs in India. So far, however, India has failed to set up modern fabs and for good reason. There are issues in terms of obtaining dependable power and water for a fab in India, according to Will Strauss, president of Forward Concepts, who added that India also suffers from government bureaucracy. India is still trying. Last week, Cricket Semicon... » read more

Multi-beam Sees The Light


The multiple-beam electron-beam market is going in two separate directions at once. Multi-beam for photomask writing is set to take off. The other market--multi-beam for direct-write lithography applications—is still in the early stages and remains in flux. In the multi-beam direct-write segment, for example, multiple sources indicate that KLA-Tencor is exiting this market to focus on its ... » read more

One-on-One: Naoya Hayashi


Semiconductor Engineering sat down to discuss the current and future challenges in the photomask industry with Naoya Hayashi, research fellow at Dai Nippon Printing (DNP). SE: What are the big challenges for the photomask industry today? Hayashi: There are several challenges. Most of the challenges involve mask complexity. It is also quite difficult to handle the mask data, because it is ... » read more

Multi-Beam Begins To Shine


After years of R&D and promises, multi-beam electron-beam technology is delayed and late to the market. The technology requires more funding and work than previously thought. And generally, the skepticism is running high for the technology. Finally, however, there is a ray of hope, and some momentum, in multi-beam—at least on the photomask front. Seeking to accelerate its multi-beam te... » read more

High NA EUV Litho May Require Larger Photomask Size


By Jeff Chappell With extreme ultraviolet lithography (EUV) potentially being used in pilot production in a few years, it raises the question of larger photomasks sizes—will the industry need them, and if so, when? While there has been discussion of late about the possible need to transition to a larger mask size, veterans of the mask business may feel it's déjà vu all over again. Back... » read more

Merchant Photomask Makers Remain Relevant


By Jeff Chappell For many years the trend in the semiconductor industry with regard to photomasks and chipmakers was to shed captive mask operations in favor of merchant photomask suppliers. This reflected a larger trend all along the supply chain with many companies moving away from vertical integration as, consequently, the foundry model grew. "This was mainly driven by cost consideratio... » read more

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