Planarization Challenges At 7nm And Beyond


Dan Sullivan, executive director of semiconductor technology at Brewer Science, digs into the challenges of planarizing a thin film on a wafer for etch and optical control. The problem becomes more difficult at advanced nodes because the films are thinner. https://youtu.be/iNA6EGpoYZU     _________________________________ See more tech talk videos here   » read more

The Problem With Spin-On Carbon Materials


In an integrated circuit manufacturing process, spin-on-carbon (SOC) materials constitute an important layer for the multilayer process to achieve smaller feature size. The SOC layer responds to the photolithography, pattern transformation, substrate planarization, and a variety of other critical processes. A key challenge in selecting a suitable material is that some processes require a hig... » read more