Multiphysics Simulations For Power Management ICs


This application brief describes Ansys Totem’s multiphysics capabilities to help you analyze power, thermal and reliability challenges in highly complex power management ICs (PMIC devices). You will understand why Totem’s many features including full-chip capacity, flexible GUI and layout-driven simulation and debug capabilities make it the ideal platform for identifying design issues. From... » read more

Transient Thermal Analysis For M.2 SSD Thermal Throttling: Detailed CFD Model vs Network-Based Model


Solid State Drive (SSD) technology continues to advance toward smaller footprints with higher bandwidth and adoption of new I/O interfaces in the PC market segment. Power performance requirements are tightening in the design process to address specific requirement along with the development of SSD technology. To meet this aggressive requirement of performance, one major issue is thermal throttl... » read more

Panel Fan-out Ramps, Challenges Remain


After years of R&D, panel-level fan-out packaging is finally beginning to ramp up in the market, at least in limited volumes for a few vendors. However, panel-level fan-out, which is an advanced form of today’s fan-out packaging, still faces several technical and cost challenges to bring this technology into the mainstream or high-volume manufacturing. Moreover, several companies are d... » read more

2.5D, FO-WLP Issues Come Into Focus


Advanced packaging is beginning to take off after years of hype, spurred by 2.5D implementations in high-performance markets and fan-out wafer-level packaging for a wide array of applications. There are now more players viewing packaging as another frontier driving innovation. But perhaps a more telling sign is that large foundries in Taiwan have begun offering packaging services to customer... » read more

Test Challenges Rising For Mobile Devices


Smartphone and tablets continue to advance at a dizzying pace. On the component side alone, the latest mobile devices are moving towards 64-bit application processors, multi-mode RF front-ends, higher-end cameras and flashy LCD screens. Some systems even boast fingerprint scanners and heart rate sensors. But an obvious part of the system continues to lag behind the curve—battery life. In r... » read more

Improved Efficiency


By Bhanu Kapoor We constantly hear about process technology advances and their impact on power consumption of ICs, but the power management techniques have remained the same over last few process technology generations. Power gating, dynamic voltage and frequency scaling, and threshold voltage scaling have been the key power management techniques since the 90nm process technology. Clock gating... » read more