Maximizing Energy Efficiency For Automotive Chips


Silicon chips are central to today’s sophisticated advanced driver assistance systems, smart safety features, and immersive infotainment systems. Industry sources estimate that now there are over 1,000 integrated circuits (ICs), or chips, in an average ICE car, and twice as many in an average EV. Such a large amount of electronics translates into kilowatts of power being consumed – equiva... » read more

Design Tool Think Tank Required


When I was in the EDA industry as a technologist, there were three main parts to my role. The first was to tell customers about new technologies being developed and tool extensions that would be appearing in the next release. These were features they might find beneficial both in the projects they were undertaking today, and even more so, would apply to future projects. Second, I would try and ... » read more

Early Architecture Performance And Power Analysis Of Multi-Die Systems


A multi-die system is a semiconductor device in which multiple homogeneous or heterogeneous dies are contained within a single package. Multi-die systems have been available for select uses for years, but they are gaining wider popularity and are expected to be used in a wide variety of end applications, including high-performance computing, automotive, and mobile. There are two main factors dr... » read more

Developing Energy-Efficient AI Accelerators For Intelligent Edge Computing And Data Centers


Artificial intelligence (AI) accelerators are deployed in data centers and at the edge to overcome conventional von Neumann bottlenecks by rapidly processing petabytes of information. Even as Moore’s law slows, AI accelerators continue to efficiently enable key applications that many of us increasingly rely on, from ChatGPT and advanced driver assistance systems (ADAS) to smart edge device... » read more

Leaning Into The SoC Power Methodology


As inflation skyrockets and the price of everything increases seemingly by the hour, finding ways to trim time and costs are more valuable than ever. Lean manufacturing was introduced by the Toyota Motor Corporation almost 100 years ago, laying the framework for future generations of manufacturing and industrial settings. Lean manufacturing is a methodology that focuses on minimizing waste w... » read more

Emulation-Centric Power Analysis Of SoC Designs


Verification expert Lauro Rizzatti recently interviewed Jean-Marie Brunet, senior marketing director, Scalable Verification Solutions Division (SVSD), Siemens EDA, about the importance of accurate power estimation and optimization for system-on-chip (SoC) designs. What is the problem facing the semiconductor industry today regarding pre-silicon power estimation? The problem is the discrep... » read more

What’s Next For Emulation


Emulation is now the cornerstone of verification for advanced chip designs, but how emulation will evolve to meet future demands involving increasingly dense, complex, and heterogeneous architectures isn't entirely clear. EDA companies have been investing heavily in emulation, increasing capacity, boosting performance, and adding new capabilities. Now the big question is how else they can le... » read more

Bringing Scalable Power Integrity Analysis To Analog IC Designs


Power integrity is a broad term in integrated circuit (IC) design and verification. However, when IC engineers are working through design signoff, power integrity analysis focuses on three specific aspects of a design: Power: Verify the chip design as implemented provides the total predicted power under different operating modes. Performance: Find and eliminate performance issues affect... » read more

Know Your Own Power, Early And Accurately


By Taruna Reddy and Vin Liao Chip designers have always had to balance timing and area. Everyone wants a design as fast as possible and as compact as possible, but these two goals are usually in conflict. For the last couple of decades, minimal power consumption has been a third goal, often of equal importance. Some of the biggest drivers for the semiconductor industry are battery operated p... » read more

Chip-Package Co-Analysis Using Ansys RedHawk-CPA


Ansys RedHawk-CPA is an integrated chip–package co-analysis solution that enables quick and accurate modeling of the package layout for inclusion in on-chip power integrity simulations using Ansys RedHawk. With RedHawk-CPA a designer can perform static IR drop analysis and AC hotspot analysis of the package layout following RedHawk static and dynamic analyses respectively. To ensure a reliab... » read more

← Older posts