Addressing Power Integrity Challenges For SoCs


Power integrity has become a crucial part of the system-on-a-chip (SoC) design flow because power-related issues can affect chip timing and even lead to complete device failure. Specifically, excessive rail voltage drop (IR-drop) and ground bounce can create timing problems and electromigration effects that impact a chip's performance and reliability. Analyzing a chip's power also poses diff... » read more

Creating Reliable SoCs For Safe ADAS Applications


Every major automaker is in the process of bringing out autonomous vehicles with ADAS (advanced driver assistance systems). In addition to processors and embedded software, ADAS requires a variety of sensors – ultrasonic, camera, RADAR (radio detection and ranging), LIDAR (light detection and ranging), GPS and IR (infrared) – that are used to recognize signs, people, animals, other vehicles... » read more

Managing Voltage Drop At 10/7nm


Power integrity is becoming a bigger problem at 10/7nm because existing tools such as static analysis no longer are sufficient. Power integrity is a function of static and dynamic voltage drop in the power delivery network. And until recently, static analysis did an effective job in measuring the overall robustness of PDN connectivity. As such, it is a proxy for PDN strength. The problem is ... » read more

10nm And 7nm Routability – How Is Your CAD Flow Doing?


At DesignCon in January, I was a panelist at a panel session entitled “Power Integrity For 10nm/7nm SoCs - Overcoming Physical Design Challenges And TAT.” I was on the panel together with Arvind Vel, Sr. Director Applications Engineering, ANSYS, Inc. and Ruggero Castagnetti, Distinguished Engineer, Broadcom Limited. This topic is of course extremely broad, but it was interesting getting fee... » read more

Routing Signals At 7nm


[getperson id="11763" comment="Tobias Bjerregaard"], [getentity id="22908" e_name="Teklatech's"] CEO, discusses the challenges of designs at 7nm and beyond, including power integrity, how to reduce IR drop and timing issues, and how to improve the economics of scaling. SE: How much further can device scaling go? Bjerregaard: The way you should look at this is [getkc id="74" comment="Moore... » read more

The Week In Review: Design


Tools Cadence launched its Sigrity 2017 technology portfolio for PCB power and signal integrity signoff, adding a power topology viewer and editor, library management for power integrity models, and a PCI Express 4.0 compliance kit for checking signal integrity. Memory Spin Transfer Technologies delivered samples of fully functional ST-MRAM (spin transfer magneto-resistive random acces... » read more

7nm Design Success Necessitates A Multi-Physics Approach


Whether you are designing an energy efficient mobile device, or an ADAS platform with stringent reliability requirements, or a high performance enterprise networking system, chips fabricated on advanced technologies such as 7-nanometer (nm) process and 2.5/3D or wafer level packaging can provide several advantages. Designs using these technologies consume less power while delivering higher thro... » read more

Hitting The Power Integrity Wall At 10nm


At 10nm and beyond, the breakdown of some historic trends tied to Moore's Law is making it harder to fully harvest the benefits of scaling semiconductor technologies. Underlying the power, performance and area benefits of scaling are technological challenges that must be solved in order to make the semiconductor products a profitable business. Power-related challenges are among the most pres... » read more

Power Integrity Optimization Cuts RF Substrate Noise


Our main focus is on dynamic voltage drop at 16-14-10nm and beyond, but the rise of the Internet of Things (IoT) prompted me to share some silicon measurement results that are relevant to the RF design community. Normally, power integrity (PI) is looked at in the time domain, but in this work we looked at it from a frequency spectrum perspective. Silicon measurements prove how shaping the dynam... » read more

Power Breaks Everything


The emphasis on lowering power in everything from wearable electronics to data centers is turning into a perfect storm for the semiconductor ecosystem. Existing methodologies need to be fixed, techniques need to be improved, and expectations need to be adjusted. And even then the problems won't go away. In the past, most issues involving power—notably current leakage, physical effects such... » read more

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