Virtual Exploration Of Novel Vertical DRAM Architectures

By Taeyon (TY) Oh - 20 Jun, 2024 - Comments: 0

In this article, we demonstrate a pathfinding technique for a novel Vertical DRAM technology. First, we identify important process parameters (defined by current semiconductor production equipment capabilities) that strongly impact yield. By using a virtual model, we then perform experimental optimization of the Vertical DRAM device across specific target ranges, to help predict and improve the... » read more

GAA NSFETs: ML for Device and Circuit Modeling

By Technical Paper Link - 30 Nov, 2023 - Comments: 0

A new technical paper titled "A Comprehensive Technique Based on Machine Learning for Device and Circuit Modeling of Gate-All-Around Nanosheet Transistors" was published by researchers at National Yang Ming Chiao Tung University. Abstract (excerpt) "Machine learning (ML) is poised to play an important part in advancing the predicting capability in semiconductor device compact modeling domai... » read more

Aging Problems At 5nm And Below

By Brian Bailey - 11 Jun, 2020 - Comments: 3

The mechanisms that cause aging in semiconductors have been known for a long time, but the concept did not concern most people because the expected lifetime of parts was far longer than their intended deployment in the field. In a short period of time, all of that has changed. As device geometries have become smaller, the issue has become more significant. At 5nm, it becomes an essential par... » read more

Trimming Waste In Chips

By Brian Bailey - 12 Oct, 2017 - Comments: 0

Extra circuitry costs money, reduces performance and increases power consumption. But how much can really be trimmed? When people are asked that question they either get defensive or they see it as an opportunity to show the advantages of their architecture, design process or IP. The same holds true for IP suppliers. Others point out that the whole concept of waste is somewhat strange, becau... » read more

Tech Talk: 14nm

By Ed Sperling - 21 May, 2015 - Comments: 0

Tamer Ragheb, digital design methodology technical lead at GlobalFoundries about what's changed with 14nm finFETs, including coloring with double patterning, new corners, Miller Effects, timing issues and variability. [youtube vid=Yk6jSKCtsjU] » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.