Tech Talk: 14nm

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• Jesse KO on Advanced Packaging Drives Test And Metrology Innovations
• Kumar on Auto Chip Aging Accelerates In Hot Climates
• Dinesh Kumar on Redefining XPU Memory For AI Data Centers Through Custom HBM4: Part 1
• Ted Wilson on Goal-Driven AI
• Art Scott (Earth ICT, SPC) on Goal-Driven AI
• Santanu on Rethinking Engineering Education In The U.S.
• JOH-POYO on FOPLP Gains Traction in Advanced Semiconductor Packaging
• Dr. Dev Gupta on One Chip Vs. Many Chiplets
• Gregory Johnson on Analysis Of Multi-Chiplet Package Designs And Requirements For Production Test Simplification
• Theodore Wilson on Shift Left Is The Tip Of The Iceberg
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• MIHAI BUTA on Managing The Huge Power Demands Of AI Everywhere
• A Duck on Batteries Look Beyond Lithium
• atharva on 2D Semiconductors Make Progress, But So Does Silicon
• Allan Cox on Big Changes Ahead For Analog Design
• S on Hardware Acceleration Approach for KAN Via Algorithm-Hardware Co-Design
• AI Research Scientist on Hardware Acceleration Approach for KAN Via Algorithm-Hardware Co-Design
• Paul Karazuba on A Buyers Guide To An NPU
• Ramesh Sharma on How Die Dimensions Challenge Assembly Processes
• Gan Future on Week In Review: Design, Low Power
• Roseann Johnson on Transitioning To Photonics
• Mohammedd Fahad on A Power-First Approach
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• Liz Allan on Early STEM Education Key To Growing Future Chip Workforce
• JML on Early STEM Education Key To Growing Future Chip Workforce
• Henley on A Buyers Guide To An NPU
• Joe L on Chip Industry Week in Review
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• Russell Klein on Fantastical Creatures
• Erik Jan Marinissen on 3.5D: The Great Compromise
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• Lincoln B on Blog Review: Aug. 7
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• Laura Peters on Key Technologies To Extend EUV To 14 Angstroms
• Tsumoru Shintake @ OIST on Key Technologies To Extend EUV To 14 Angstroms
• Ev Roach on Will AI Disrupt EDA?
• Dr David Serena on Electromigration Performance Of Fine-Line Cu Redistribution Layer (RDL) For HDFO Packaging
• Jerome Poussin on Navigating the Metrology Maze For GAA FETs
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• Dr. Dev Gupta on Intel Vs. Samsung Vs. TSMC
• Kenny Hatton on Intel Vs. Samsung Vs. TSMC
• Robert N. Blair on Intel Vs. Samsung Vs. TSMC
• MrChippy on Glass Substrates Gain Foothold In Advanced Packages
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• Ron Lavallee on The Value Of Innovation
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• Daniel B on U.S. Proposes Restrictions On Tech Investments In China
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• Tarhib IT Limited on Improving Redistribution Layers for Fan-out Packages And SiPs
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• Srini Balan on LPDDR Memory Is Key For On-Device AI Performance
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• SpeedRazor on Making Chips To Last Their Expected Lifetimes
• Cyrus on What Designers Need To Know About GAA
• equinn on Automotive Electronics Reliability Requires In-Field Silicon Monitoring
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• Dr. Benjamin Fasano exIBM/exGF on The Race To Glass Substrates
• Dr. Dev Gupta on The Race To Glass Substrates
• Art Scott on DAC Panel Could Spark Fireworks
• Mark Camenzind on The Race To Glass Substrates
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• Sam on What Designers Need To Know About GAA
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• Jan Hoppe on Battling Fab Cycle Times
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• Kevin Yao on 224G SerDes Trend and Solution
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• Ron Lavallee on Is There Any Hope For Asynchronous Design?
• Mahdoum on Multi-Die Design Pushes Complexity To The Max
• Cliff Cummings on Is There Any Hope For Asynchronous Design?
• Yaron k. on Is There Any Hope For Asynchronous Design?
• Shiv Sikand on Is There Any Hope For Asynchronous Design?
• Anne Meixner on Too Much Fab And Test Data, Low Utilization
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• Dr. Richard Roy on Future-Proofing Automotive V2X
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• Liz Allan on Early STEM Education Key To Growing Future Chip Workforce
• Rob Pearson - RIT on Early STEM Education Key To Growing Future Chip Workforce
• Maury Wood on Examining The Impact Of Chip Power Reduction On Data Center Economics
• Erik Jan Marinissen on Chiplet IP Standards Are Just The Beginning
• Peter Bennet on Design Tool Think Tank Required
• Dr. Dev Gupta on Chiplet IP Standards Are Just The Beginning
• Jesse on Hunting For Open Defects In Advanced Packages
• Matt on Chip Ecosystem Apprenticeships Help Close The Talent Gap
• Leonard Schaper IEEE-LF on 2.5D Integration: Big Chip Or Small PCB?
• Apex on Nanoimprint Finally Finds Its Footing
• AKC on Gearing Up For Hybrid Bonding
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• Nathaniel on Intel, And Others, Inside
• Chris G on Intel, And Others, Inside
• Richard Collins on Too Much Fab And Test Data, Low Utilization
• Jerry Magera on Why Chiplets Are So Critical In Automotive
• Jenn Mullen on Shattered Silos: 2024’s Top Technology Trends
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• Robin Grindley on Expand Your Semiconductor’s Market With Programmable Data Planes
• V.P.Sampath on RISC-V Micro-Architectural Verification
• Thermal Guy on Is UCIe Really Universal?
• Colt Wright on Shattered Silos: 2024’s Top Technology Trends
• Nicolas Dujarrier on The Future Of Memory
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• Raymond Meixner's child on Visa Shakeup On Tap To Help Solve Worker Shortage
• Michael Alan Bruzzone on How Is The Chip Industry Really Doing?
• Art Scott on How Is The Chip Industry Really Doing?
• Liz Allan on Rethinking Engineering Education In The U.S.
• Telkom University on Rethinking Engineering Education In The U.S.