Interdependencies Complicate IC Power Grid Design


Creating the right power grid is a growing problem in leading-edge chips. IP and SoC providers are spending a considerable amount of time defining the architecture of logic libraries in order to enable different power grids to satisfy the needs of different market segments. The end of Dennard scaling is one of the reasons for the increased focus. With the move to smaller nodes, the amount of... » read more

A Study Of Next-Generation CFET Process Integration Options


Decision making is a critical step in semiconductor technology development. R&D semiconductor engineers must consider different design and process options early in the development of a next-generation technology. Established techniques such as Failure Mode and Effect Analysis (FMEA) can be used to select among the most promising design and process choices. Once specific design and process m... » read more

Making Random Variation Less Random


The economics for random variation are changing, particularly at advanced nodes and in complex packaging schemes. Random variation always will exist in semiconductor manufacturing processes, but much of what is called random has a traceable root cause. The reason it is classified as random is that it is expensive to track down all of the various quirks in a complex manufacturing process or i... » read more

How FinFET Device Performance Is Affected By Epitaxial Process Variations


By Shih-Hao (Jacky) Huang and Yu De Chen As the need to scale transistors to ever-smaller sizes continues to press on technology designers, the impact of parasitic resistance and capacitance can approach or even outpace other aspects of transistor performance, such as fringing capacitance or source drain resistance. The total resistance in a device is comprised of two components: internal re... » read more

Effects Of A Random Process Variation On The Transfer Characteristics Of A Fundamental Photonic Integrated Circuit Component


Silicon photonics is rapidly emerging as a promising technology to enable higher bandwidth, lower energy, and lower latency communication and information processing, and other applications. In silicon photonics, existing CMOS manufacturing infrastructure and techniques are leveraged. However, a key challenge for silicon photonics is the lack of mature models that take into account known CMOS pr... » read more

Node Within A Node


Enough margin exists in manufacturing processes to carve out the equivalent of a full node of scaling, but shrinking that margin will require a collective push across the entire semiconductor manufacturing supply chain. Margin is built into manufacturing at various stages to ensure that chips are manufacturable and yield sufficiently. It can include everything from variation in how lines are... » read more

Controlling Variability And Cost At 3nm And Beyond


Richard Gottscho, executive vice president and CTO of Lam Research, sat down with Semiconductor Engineering to talk about how to utilize more data from sensors in manufacturing equipment, the migration to new process nodes, and advancements in ALE and materials that could have a big impact on controlling costs. What follows are excerpts of that conversation. SE: As more sensors are added int... » read more

Controlling IC Manufacturing Processes For Yield


Equipment and tools vendors are starting to focus on data as a means of improving yield, adding more sensors and analysis capabilities into the manufacturing flow to circumvent problems in real time. How much this will impact the cost of developing complex chips at leading-edge nodes, and in 2.5D and 3D-IC packages, remains to be seen. But the race to both generate data during manufacturing ... » read more

The Mighty Sensor In The Fab


The days of scheduled maintenance on fab equipment are coming to an end. In fact, the entire service model as we know it is about to undergo a mammoth change. The addition of more sensors into manufacturing equipment may seem like an evolutionary step, but the impact is going to be much more significant than it might appear. Rather than just alerting fab managers or equipment makers when a p... » read more

Effects of a Random Process Variation on the Transfer Characteristics of a Fundamental Photonic Integrated Circuit Component


Silicon photonics is rapidly emerging as a promising technology to enable higher bandwidth, lower energy, and lower latency communication and information processing, and other applications. In silicon photonics, existing CMOS manufacturing infrastructure and techniques are leveraged. However, a key challenge for silicon photonics is the lack of mature models that take into account known CMOS pr... » read more

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